Features
Liquid Cooling Utilizing Stacked Microchannels
Moore's Law, which states that the numbers of transistors that can be placed inexpensively on an integrated circuit will double every 18 months, has been valid for more than 50 years. To extend Moore's Law to the foreseeable future, it will require a change from mere transistor scaling to novel packaging architectures such as so-called 3D integration, the vertical integration of chips and innovative cooling solutions.
Performance of Fans and Blowers in Thermal Management
Fans have been traditionally been used in cooling devices and will be used for the foreseeable future, since their implementation is the easiest. As the world becomes more concerned about energy uses and efficiencies of the systems, it is imperative that the designer takes into account all the factors that influence the performance of the fan.
Recent Developments in Liquid Cooling Approaches for Data Centers
The question arises, why pay more for a higher-efficient heat sink that is also smaller and lighter in weight, especially in cases whereby a simple, larger but heavier cast or extruded heat sink can also do the job? In most cases, the single-piece part price is the main driver as to why engineers and purchasers stay with lesser effective solutions.
Technology Review – Liquid Cooling, 1992-2003
In a new series, Qpedia reviews the different technologies that have been developed for electronics cooling applications. This series looks at the patents awarded to developers in industry and academia around the world who are actively involved in addressing cooling challenges.
Cooling News – Product News, Industry News, Upcoming Thermal Management Events