Mouser and Advanced Thermal Solutions, Inc. (ATS) Sign Global Distribution Agreement

Mouser

 

 

 

May 23, 2013 – Advanced Thermal Solutions, Inc. (ATS) today announced a new global agreement with Mouser Electronics, Inc. to distribute high performance heat sinks and cooling solutions.

The agreement with ATS means Mouser Electronics customers will have access to a wide range of high performance heat sinks available in thousands of shapes and sizes. ATS heat sinks are designed for use in many applications including telecom, datacom, LED, automotive, medical, and aerospace. Their maxiFLOW™ heat sinks feature a low profile spread fin array that maximizes surface area, yielding the highest thermal performance of any heat sink on the market. ATS maxiFLOW™ heat sinks are available with thermal tape, push pin or its patented maxiGRIP™ attachment methodology. ATS maxiGRIP assemblies permit secure attachment of heat sinks to BGAs, flip chips and other hot components on a PCB with steady, even pressure and without any need to drill holes in the board. Both the spring and frame clip in the maxiGRIP assembly can be easily removed, allowing the heat sink to be detached and re-attached without damaging the device, surrounding components or PCB. All ATS maxiGRIP heat sinks are fabricated with high-performance, phase-changing thermal interface material to further maximize performance. Mouser Electronics stocks an extensive line-up of the ATS LED heat sinks, including both the linear style and the round/star shape in a wide variety of sizes; fansinks using maxiGRIP attachment, and a full line of maxiFLOW heat sinks for brick DC/DC converters.

“We are very pleased to present to our customers the world-renowned ATS line of heat sinks,” says Keith Privett, Mouser Electronics Vice President of Electromechanical, Power, and Test. “Our broad product offering will provide customers with cooling solutions for LEDs, BGAs, power supplies, and specific devices such as flip-chip processors.”

“Amongst many air and liquid high capacity cooling solutions, ATS provides the widest range of high performance heat sinks for cooling today’s hot-running electronic devices,” says Sharon Koss, VP of Operations and Business Development of ATS. “We look forward to providing thermal solutions to Mouser’s customers around the world.” To view these and other products by ATS, visit http://www.mouser.com/Advanced-Thermal-Solutions/.

With its broad product line and unsurpassed customer service, Mouser caters to design engineers and buyers by delivering “What’s Next” in advanced technologies. Mouser offers customers 19 global support locations and stocks the world’s widest selection of the latest semiconductors and electronic components for the newest design projects.

Mouser Electronics’ website is updated daily and searches more than 10 million products to locate over 3 million orderable part numbers available for easy online purchase. Mouser.com also houses an industry-first interactive catalog, data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

About Mouser Electronics

Mouser Electronics, a subsidiary of TTI, Inc., is part of Warren Buffett’s Berkshire Hathaway family of companies. Mouser is an award-winning, authorized semiconductor and electronic component distributor, focused on the rapid introduction of new products and technologies to electronic design engineers and buyers. Mouser.com features more than 3 million products online from more than 500 manufacturers. Mouser publishes multiple catalogs per year providing designers with up-to-date data on the components now available for the next generation of electronic devices.  Mouser ships globally to over 375,000 customers in 170 countries from its 492,000 sq. ft. state-of-the-art facility south of Dallas, Texas.  For more information, visit http://www.mouser.com.

Join ATS at the Real-Time Embedded Computing Conference

ATS will be among fellow industry leaders, at the Real-Time Embedded Computing Conference this May 7th and May 9th, 2012. Attendees will learn what’s on the cutting-edge in the Embedded Computing industry and talk with fellow industry leaders about emerging technology, products, and services available in the market.
To get excited for the conference, we are giving away a white paper, originally published in Qpedia Thermal eMagazine, titled “Device Thermal Coupling on a PCB” . Download your copy for free.
Learn More about the Real-Time Embedded Computing Conference:
May 7 in Nashua, NH
Luncheon Keynote:
“Ten Technology Trends That Revamp the ‘System’ Definition”
presented by Jeff Child, Editor in Chief, COTS Journal

Embedding computing and electronics technology has reached a new era where the definition of “system” is changing. Technology integration has shifted the level of functionally on the chip, board and box-level. And interconnects between those new “system” blocks constantly have to keep up. Today’s new levels of compute density, functionality and networking available is opening up new options for defense, industrial control, medical systems and many other applications. Highly integrated FPGAs, comprehensive software development tools, high-speed fabric interconnects and turn-key box level systems are just a few of players in this story of the embedded system evolution. In this keynote, Jeff Child, Editor-in-Chief of COTS Journal, explores the top 10 trends that underlie this changing definition of what a “system” is.

May 9 in Boston, MA
“Sustainable Business in Unsustainable Times …”
presented by James B. Doyle, President and CEO of ECM RF,
and former Congressional Affairs Liaison
This talk will explore some of the changes occurring today that will impact business models for the future, not just changes in the global economy or government policy, but how the environment and disruptive technology is a game changer to the way we used to do business. There is tremendous opportunity for business in the next decade and beyond if you understand and can appreciate the speed of changes that are occurring in the environments around you. Technology coupled with knowledge holds the key to sustainable business success.
“The Evolving Role of M2M in Intelligent Systems and the Internet of Things: A Multi-perspective Panel Discussion”

When the topic of machine-to-machine (M2M) first began, it was narrower than it is today and spanned just a few markets. We’re no longer talking about connecting just a few systems on a factory floor for work-flow optimization. Rather, today it is a matter of connecting devices and people across the globe and across many functions and even the consumers. This means that how M2M is implemented has had to evolve and has to have built in flexibility to be able to enable the yet-to-come connectivity demands. Each of the panelists for this discussion brings knowledge about where M2M has been and where it has yet to go to keep pace with the growing scope of the Internet of Things (IoT).

Increased Performance from High Aspect Ratio Heat Sinks

High Aspect Ratio Heat Sinks from ATSA heat sink’s aspect ratio is basically the comparison of its fin height to the distance between its fins.  In typical heat sinks the aspect ratio is between 3:1 and 5:1. A high aspect ratio heat sink has taller fins with a smaller distance between them for a ratio that can be 8:1 to 16:1 or greater.

Thus, a high aspect ratio heat sink provides greater density of fins in a given footprint than a more common sink, and/or stands taller than its conventional counterpart. The great benefit from a high aspect ratio heat sink is the increased amount of heat dissipating surfaces it provides due to its additional fins. Further, these heat sinks do not occupy any more length or width. The result is a more efficient heat sink with higher performance per gram in the same footprint.

Many common heat sinks are unable to serve the needs of high volume applications, due to the fact that their cooling capacity – measured in part by the aspect ratio – is simply not great enough. By nearly doubling a heat sink’s aspect ratio the cooling performance is optimized and heat issues resolved without the need for more complex solutions.

Because high aspect ratio heat sinks are manufactured in similar fashion as conventional heat sinks, their cost is not significantly higher. They can be extruded or bonded. Fins can be straight or folded. For omnidirectional purposes a high density of pins can be used as heat spreaders in place of fins.

High aspect ratio heat sinks are often ideal thermal solutions for workstation CPUs, high performance power supplies and converters, and high-end amplifiers.

Of critical importance when using high aspect ratio heat sinks is providing sufficient airflow to carry away the radiating heat. Passive cooling, e.g. conduction and radiation may be inadequate.  Convective heat transfer removes essentially all of the energy from a heat sink under forced air cooling. Particularly with dense fin fields, an improperly directed fan may create stagnation points and high pressure loss.   Thermal modeling is recommended when determining the needed active cooling resources.

New Consulting Project Subscription Plan

ATS has released a Consulting Project Subscription Plan (CPSP) for engineering services. From our corporate headquarters in Norwood, Massachusetts,we offers comprehensive thermal management analysis and design services for the telecommunications, medical, military, defense, aerospace, automotive, and embedded computing industries. The new plan allows ATS engineers to become an extension of your team for a pre-determined amount of hours, providing expert thermal and mechanical engineering consultation, design, simulation, testing and validation.

ATS Design Services

Services include Design, Simulation, Testing, Analysis & Prototyping

The CPSP includes the use of ATS’ thermal lab facilities and covers all projects approved by an authorized representative of subscribed customers. ATS’ thermal management analysis and design services encompass both experimental and computational simulations using proprietary tools and computational fluid dynamics software packages such as FLOTHERM and CFdesign.

Thermal Testing & Analysis

Thermal Testing & Analysis

The new subscription plan gives customers priority access to ATS engineering and manufacturing resources for all chip, board, enclosure, and system related projects. ATS studies the full packaging domain, including components, circuit boards (PCBs), shelves, chassis, and system packaging.

Consulting capabilities include:

- heat sink, board and fan characterization

- heat sink design and optimization

- PCB & fan tray design and optimization

- liquid cooling design

- prototyping of heat sinks and complete cooling systems

- wind tunnel testing of components, PCBs, chassis and enclosures

ATS offers rapid prototyping of machined parts and cooling systems from its US facilities. Sheet metal fabrication and cut heat sink prototypes are quickly provided from international partners.

Liquid Crystal Thermography

Liquid Crystal Thermography

ATS believes that customers who wish to remain competitive should consider a design-to-suit opportunity solution first. Contrary to common perception, this proves to be less expensive to the customer in the long run, because of the ensuing gain in product efficiency and compatibility. Working side-by-side with customers worldwide, ATS engineers provide tailored solutions to thermal and mechanical packaging challenges on real projects with real schedules.

To learn more about the consulting project subscription plan, call 781-769-2800, email ats-hq@qats.com, or visit www.qats.com.

New maxiFLOW DC-DC Brick Heat Sinks Ideal for Military-COTS Applications

ATS has recently launched a new product line of maxiFLOW™ heat sinks, specially designed to cool DC-DC converters. The new line of heat sinks can be used with Vicor’s DC-DC converter Bricks, including their military-COTS applications.

Vicor’s Maxi, Mini, and Micro series DC-DC converters are relied upon by over eight thousand OEMs for their proven performance, broad coverage of input and output voltages, ease of mechanical mounting and thermal management flexibility. These converter modules use advanced power processing, control, and packaging technologies to provide the performance, flexibility, and ruggedness expected in a Military COTS product. High frequency ZCS/ZVS switching, advanced power semiconductor packaging, and thermal management provide high-power density with low noise and high efficiency.

maxiFLOW Heat Sink for Half Brick DC-DC Converters

 

ATS’ patented maxiFLOW™ technology cools millions of BGAs and other PCB components. The same technology is now available for cooling eighth, quarter, half and full brick modules, such as the Micro, Mini, and Maxi series from Vicor. Unlike other converter heat sinks, the patented maxiFLOW™ heat sink design reduces air pressure drop and provides greater surface area, increasing thermal performance by 30-200%.

Vicor’s Micro, Mini, and Maxi DC-DC Converters

Vicor’s offering of full, half, and quarter-brick modules feature a patented low noise design with the highest reliability and power density available. Fully encapsulated, Maxi, Mini and Micro series DC-DC converters utilize a proprietary spin fill process that assures complete, void free encapsulation making them suitable for the harshest environments. Two grades (H & M) are available with temperatures to -55°C operating and -65°C storage. H & M-Grade modules are qualified to the stringent environmental tests of MIL-STD-810 and MIL-STD-202 and undergo 100% Environment Stress Screening.

By combining technology from industry leaders Vicor and ATS, it can be ensured that DC-DC converters will have superior performance in the harshest environments, which is vital for military and aerospace applications.

To learn more about maxiFLOW™ Brick DC-DC converter heat sinks, please visit www.qats.com, email ats-hq@qats.com, or call 781-769-2800.