Our first reaction when we saw the press release from Fujipoly was one of skepticism. Here’s the full release:
Carteret, NJ Monday, November 15, 2010 A new thermal material breakthrough from Fujipoly allows engineers to reduce chip and circuit temperature by as much as 11% without the need for a heatsink.
The advanced 4-ply, peel-n-stick FPDSEM 90 Cooling Patch offers the fastest and easiest way to radiate heat from an electronic component to the surrounding environment. All you need to do is apply the patch like a sticker to the surface of any hot spot. The material can also be custom cut or trimmed to fit virtually any shape.
The low resistance Cooling Patch provides a thermal conductivity of 1.5 W/m°K and a thermal emissivity of 0.97. Fujipolys FPDSEM 90 is 25mm thick and can be ordered in sheets, rolls or kiss-cut rolls depending on your application.
The phrase our team focused on was, “reduce chip and circuit temperature by as much as 11% without the need for a heatsink.
Here’s a .jpg of their new thermal material. The green marker points to the Fujipoly TIM while the blue marker points to the semiconductor (or click on the photo to zoom in on it)
While the claims are impressive, unless the paste has significant emissivity (highly metalized) our team did not see how it would work. We speculate that Fujipoly may have developed a special material; however, the 10-11% thermal reduction will not work at higher velocity flow , anything more than 1-1.25 m/s the impact is in 1-2%.
If anyone of our readers gives this material a try before us, drop us a line and let us know what you learned; joday-at-qats.com