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New Electronics Cooling Webinars are Open for Second Quarter of 2012

Posted on April 3, 2012 | 1 Comment

Each month during the second quarter of 2012, ATS will present a technical webinar covering different topics within the dynamic world of electronics cooling. Each of these one-hour, online tutorials will include detailed visuals, definitions, instructions, case studies and references. One or more ATS PhD-level thermal engineers will be presenting live. Viewers will be able to key in questions during and after the presentation.

Each Q2 webinar is planned for a Thursday afternoon (ET) late in the month. These are the second quarter topics for the ATS webinars:

April 26, 2012 at 2:00 p.m. ET

How to Perform and Understand Air Velocity Measurement within Electronics Systems

Participants will learn about the importance of measuring air velocity in a system, the instruments necessary for obtaining useful measurements and where these velocities should be recorded.

 May 24, 2012 at 2:00 p.m. ET

CFD as a Tool to Perform Heat Sink and System Modeling

Computational Fluid Dynamics (CFD) tools have become indispensable simulation tools, enabling design engineers to confront electronics cooling challenges on demand. Some tips and tricks are invaluable in performing these analyses. Among them: the simplest methods of preparing a CFD model; the best techniques for meshing; and how to model a system’s components, such as fans and perforated plates. Attendees will learn about common and not-so-common issues in CFD, and how to overcome them.

June 28, 2012 at 2:00 p.m. ET

Heat Sink Selection Made Easy

As heat dissipation needs for electronic devices rapidly grow, choosing the right heat sink the first time is essential. With so many application requirements and heat sink options, this can be a daunting task. In this webinar, attendees will learn about the importance of system airflow and its impact on heat sink design; attachment methods; and how to solve thermal design challenges.

 Seats at each of these webinars are free, but limited. Registration is available online at http://www.qats.com, or by calling 1-781-949-2522.

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Posted in CFD, heat sink, Sensor, thermal management, Training, Webinar

This Fixed Cost Plan for Cooling Hot PCBs Saves Money, Simplifies Ordering

Posted on March 27, 2012 | Leave a comment

For one fixed cost, a QoolPCB plan includes the full set of ATS heat sinks,  attachment devices and all other parts required for the effective thermal management of a PCB’s components. There are no additional costs for the thermal engineering, performance testing, procurement or shipping.  The heat sinks and hardware are kitted and provided for the full volume of boards requiring cooling.

Pricing for a QoolPCB solutions is based on the number of heat sinks that a specific PCB requires for efficient thermal management.  For example, if thermal analysis and testing show that a PCB needs 10 heat sinks to operate afely, the fixed price for the heat sinks and hardware for a production volume of that PCB would be just $50 per board. For larger boards, or those with many hot components, the unit cost per heat sink is reduced.

Whether the solutions are for off-the-shelf heat sinks, custom designed, or a combination of both, the QoolPCB program from ATS provides it at fixed cost. QoolPCB eliminates separate costs for design, tooling, samples, verification and supply chain management. The program offers multiple benefits for companies looking to reduce their product development costs, speed time-to-market and ensure thermal reliability.

To participate, PCB developers simply provide 3D CAD models of their board layout, along with the technical specifications, including power dissipation of all board components. ATS performs a full thermal analysis of the PCB and develops a comprehensive cooling solution for each component on the board. Where possible, ATS engineers will specify existing heat sinks from a portfolio of more than 3000 off-the-shelf and application-specific designs and with in-stock attachment systems.

If any custom heat sinks are required to bring certain components within their manufacturer-designated running temperatures, ATS assumes all tooling charges and sample production costs, including any customized heat sink attachment hardware. In addition, ATS will perform all physical testing at its Thermal Characterization Laboratory, which features advanced open loop and closed loop wind tunnels, temperature and velocity measurement sensors and other analysis instrumentation, to verify the cooling design. All designs and performance reports are provided to customers, who can perform their own thermal analyses and verification studies using the ATS characterization lab and samples of the actual heat sink solutions at no extra cost.

More information about the QoolPCB thermal management program from ATS is available at: http://www.qats.com/Services/QoolPCB—PCB-Cooling-At-Fixed-Cost/57.aspx

 

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Posted in Cabinet, heat sink, Heat Sinks, PCB, Thermal, thermal engineering, thermal management

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Getting the Maximum Performance from Heat Sink Clips

Posted on March 22, 2012 | Leave a comment

As power levels for board components have risen, thermal engineers have been forced to design larger and more innovative heat sinks than ever before.  Along with the thermal challenge has come the mechanical challenge of attaching these heat sinks to the components in a reliable fashion.

One of the most popular methods uses some form of clip. These are low in price and easily applied. Smart engineering has led to clip systems that provide strong, even pressure well beyond the working life of the component. They hold their heat sinks tight even when dropped or shocked, but they can be unclipped manually whenever it’s necessary.

Clips that attach directly to the component provide an advantage over other clip types, (e.g. z-clips) in that no holes are required in the PWB.  The ATS maxiGRIP is an example of such an attachment.   maxiGrip uses a plastic frame clip that attaches directly to the component and provides a mounting platform for a custom spring clip (Figure 5).


The frame clip is installed, using a special tool which expands all four sides of the clip simultaneously, allowing the clip to be placed directly over the component package (A keep out area is usually required).  Once released, tabs on each side engage and secure the clip to the component, creating a secure mounting platform for the spring clip.  The spring clip, which is designed to provide a very precise load, is then installed to hold the heat sink in place, maintaining continuous pressure at the heat sink component interface.   The maxiGripTM assembly has a big advantage over other heat sink attachment methods in that it allows for the use of high performance phase change interface materials.

Extensive FEA and shock and vibration testing of the maxiGripTM assembly have been done to provide a carefully engineered heat sink attachment solution with a high-level of reliability.

 

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Posted in heat sink, Heat Sink Attach, heat sink clip, Heat Sinks

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Using Thermoelectric Coolers in Electronics Cooling

Posted on March 20, 2012 | Leave a comment

Thermoelectric devices are semiconductor modules which use the Peltier Effect to create a heat flux between the junctions of two different types of materials. Named after French physicist Athanase Peltier, the Effect shows that a temperature differential is created when DC current is applied across two dissimilar materials. (It is one of the three thermoelectric effects; the others are the Seebeck Effect and Thomson Effect.)

 A typical thermoelectric module is manufactured using two thin ceramic wafers with a series of N and P doped bismuth-telluride semiconductor material sandwiched between them. The ceramic material adds rigidity and the necessary electrical insulation. The N type material has excess electrons, while the P type material has a deficit of electrons. One N and one P make up a couple.

 When a DC current is applied to the circuit, the thermoelectric module can work as a cooler or heater depending on the current’s direction. A thermoelectric cooler (TEC), or solid state heat pump transfers heat from one side of the device to the other side against the temperature gradient. Many products use thermoelectric coolers, including small refrigeration systems, CCD cameras, laser diodes and portable picnic coolers. They are also used in the thermal management of microprocessors, memory modules and other electronic devices.

Although a TEC provides a very simple and reliable solution for cooling devices, its poor thermal performance prevents its broader usage. Compared with traditional refrigeration systems, the coefficient of performance (COP) of a TEC is only about 1/5 that of a refrigeration system using a vapor compression cycle. Currently, the uses of TECs in electronics cooling are limited to systems that require temperature stability or sub-ambient operating conditions, or specially designed devices. Laser beam components and high energy optical modules are such examples.

 

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Posted in cooling

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Check out the new and improved LED Cooling Resource Kit

Posted on March 8, 2012 | Leave a comment

ATS, Advanced Thermal Solutions, Inc, has compiled several expert technical resources for thermally managing LED lighting. The Expert Resource Kit for Better Thermal Management of LED Lighting is compendium of free downloadable information.

The Kit is specifically for thermal management professionals in the LED lighting industry and for engineers who are responsible for ensuring the proper performance of LED designs.

Included in the Resource Kit are:

  • LED Heat Transfer and Cooling Options:  Lighting the Way for LED Development
  • Mentor Graphics Webinar (free registration required): Diagnosing and Solving Thermal Challenges in Next Generation LED
  • ATS Case Study: Feasibility Study of an LED-Based Lighting System Using Analytical Modeling
  • ATS Article: How to Cool High Power LEDs
  • Clemens Lasance Lecture on LED Thermal Management:  Thermal Management for LED Applications: What is the Role of the PCB?
  • Clemens Lasance, Michael Gay, Norm Berry, Richard A. Wessel on MCPCB’s for LED Applications:  MCPCB’s for LED Applications, Thermal Management Material Specifications
  • Dr. Kaveh Azar Video Interview: LED Heat Sink Types and Applications

The free LED Cooling Resource Kit can be accessed at: http://qats.com/cms/free-thermal-management-led-lighting-resource-kit/

 

 

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Posted in LED

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