Tag Archives: analysis

Dr. Kaveh Azar Interview on ATS’s New Thermal Engineering Design Service for Verizon’s VZ.TPR.9208

We’ve started a new regular feature here at ATS, “The ATS Product Highlight”.   Our readers can glance to the right hand column to see our inaugral  highlight, ATS’s Verizon’s Thermal Management Design Services, a complete set of services to assist the OEM in passing Verizon’s new NEBS VZ.TPR.9208 Thermal Management Requirements for Improved Energy Efficiency of Telecommunications Equipment.

We caught up with our CEO,  Dr. Kaveh Azar, to ask him a few questions about why ATS decided to start such a service, what services ATS is providing and more.   Just click on the Slidecast below for this 4 minute overview on ATS’s new service:



Our readers can also checkout our initial announcement at heatsinks.wordpress.com by clicking to our post, “ATS Announces Thermal Design Services to help Telecom Equip OEMs meet Verizon’s VZ.TPR.9208 Thermal Management Req.” and our readers can see a 3 minute interview of Verizon’s Chuck Graff, the author of VZ.TPR.9208, as to why Verizon decided to release this specification by clicking to, “Verizon’s Chuck Graff speech on VZ.TPR.9208 Thermal Management Spec; Pass Verizon’s tests by partnering with ATS

ATS Announces Free Webinar: Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis

ATS Announces Free Webinar: Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis on Thursday, May 27, 2010 2:00 PM – 3:00 PM EDT

ATCA and MicroTCA are chassis standards geared to getting systems from telecomm, computing, military, medical and other companies to market faster and with lower cost. While the form factor, modularity and price point are attractive, thermal challenges can be magnified with the small form factors and interoperability challenges of a standard architecture. Attendees will be equipped with advanced, fast and accurate thermal design techniques that will help them efficiently use modeling and testing tools to determine device junction temperatures and speed time-to-market.

To register please visit our registration site here:
Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis