Tag Archives: chassis

Jet Impingement for thermal management: a practical approach to using it in 1U Server Chassis

Jet impingement for thermal management can give you a cost effective, highly directed airflow that can really help semiconductor cooling in your systems.  But how do you cost effectively implement such a technology in low cost, 1U servers?  Would just going to water, as Google did with their latest patent on a server cooling “sandwich”?

ATS has invented a method to easily deploy jet impingement cooling in both 1U low cost computer servers and in 6U ATCA Chassis.   We call it ThermJETTTM.  Some of the key elements include:

  • Test results showing cooling PCBs 20C better than conventional methods
  • No liquid
  • Relatively easy to implement with mechanical changes

Our readers can learn about ThermJETTTM by calling us at 781-769-2800, emailing us at sales.hq@qats.com or read more at the embedded presentation on ThermJETTTM below:

ATS Announces Free Webinar: Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis

ATS Announces Free Webinar: Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis on Thursday, May 27, 2010 2:00 PM – 3:00 PM EDT

ATCA and MicroTCA are chassis standards geared to getting systems from telecomm, computing, military, medical and other companies to market faster and with lower cost. While the form factor, modularity and price point are attractive, thermal challenges can be magnified with the small form factors and interoperability challenges of a standard architecture. Attendees will be equipped with advanced, fast and accurate thermal design techniques that will help them efficiently use modeling and testing tools to determine device junction temperatures and speed time-to-market.

To register please visit our registration site here:
Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis