Tag Archives: design

Dr. Kaveh Azar Interview on ATS’s New Thermal Engineering Design Service for Verizon’s VZ.TPR.9208

Posted on May 10, 2010 | Leave a comment

We’ve started a new regular feature here at ATS, “The ATS Product Highlight”.   Our readers can glance to the right hand column to see our inaugral  highlight, ATS’s Verizon’s Thermal Management Design Services, a complete set of services to assist the OEM in passing Verizon’s new NEBS VZ.TPR.9208 Thermal Management Requirements for Improved Energy Efficiency of Telecommunications Equipment.

We caught up with our CEO,  Dr. Kaveh Azar, to ask him a few questions about why ATS decided to start such a service, what services ATS is providing and more.   Just click on the Slidecast below for this 4 minute overview on ATS’s new service:



Our readers can also checkout our initial announcement at heatsinks.wordpress.com by clicking to our post, “ATS Announces Thermal Design Services to help Telecom Equip OEMs meet Verizon’s VZ.TPR.9208 Thermal Management Req.” and our readers can see a 3 minute interview of Verizon’s Chuck Graff, the author of VZ.TPR.9208, as to why Verizon decided to release this specification by clicking to, “Verizon’s Chuck Graff speech on VZ.TPR.9208 Thermal Management Spec; Pass Verizon’s tests by partnering with ATS“

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Posted in Analysis, Thermal Design, thermal management

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Liquid Cooling and Two Phase Cooling: A Case Study to Examine the Tradeoffs for a Best Solution

Posted on May 7, 2010 | Leave a comment

Electronics Cooling has published a study by Anurag Gupta, David H. Altman and Stephen J. Pereira to demonstrate the trade-offs between liquid and two-phase cooling schemes for small-channel heat sinks in high heat flux applications.

The study is a fascinating examination of the topic and has some interesting results that are worth noting. Applications for liquid cooling are growing and understand the tradeoffs in different approaches is a critical element in determining an engineers best options.

You can read the study at Electronics Cooling by clicking to this link: a case study to demonstrate the trade-offs between liquid and two-phase cooling schemes for small-channel heat sinks in high heat flux applications

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Posted in Heat Sinks, Liquid Cooling

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Verizon’s Chuck Graff speech on VZ.TPR.9208 Thermal Management Spec; Pass Verizon’s tests by partnering with ATS

Posted on May 5, 2010 | Leave a comment

Last week we told everyone that July 1st, 2010, Verizon’s Thermal Management Requirements for Improved Energy Efficiency of Telecommunications Equipment, Verizon Technical Purchasing Requirements VZ-TPR-9208, will come into full effect.

Light Reading taped TPR-9208′s author, Chuck Graff, during a speech, where he describes the specification and what is expected of OEM equipment providers:  Verizon’s Chuck Graff Light Reading Speech on VZ.TPR.9208

Clearly this is a big change for the entire ecosystem of equipment providers.

Last week we introduced our readers to ATS’s newly formed Verizon’s Thermal Management Design Services and this week we want to provide more details of our service and how to partner with us.

Our services team and skills include:

  • An expert team with 150 years of collective experience in thermal design
  • State of the art thermal testing facilities
  • Expert-level knowledge of the latest CFD and other simulation tools
  • Unmatched experience in electronics cooling and thermal management
  • CFD analysis
  • Thermal modeling
  • Simulation of a wide range of conditions
  • Design based on NEBS and other requirements

Our service set offers two options:

Thermal Design Audit:

  • Product Is Ready for Verizon Test: before you send the system for testing, ATS team will come to your facility and conduct a full audit on your thermal design and analysis procedure. Minimum engagement fee is $10,000.00 for a five day audit.

Product in Design Stage:

  • ATS will design the thermal and mechanical portion of your system based on industry’s best practices in the shortest amount of time. ATS will provide you with full documentation that is ready for production as well Verizon’s TPR-9208 test.

ATS services allow the OEM to avoid rejection of their systems by Verizon or the approved labs since the design will be done right-the-first-time and in accordance to the requirements. You can learn about our service at our corporate web site by visiting this link: Verizon’s Thermal Management Design Services

Engage with us today by contacting us at our corporate web site:  Contact ATS

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Posted in Consulting, Engineering, Thermal Design

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ATS Announces Free Webinar: Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis

Posted on May 3, 2010 | Leave a comment

ATS Announces Free Webinar: Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis on Thursday, May 27, 2010 2:00 PM – 3:00 PM EDT

ATCA and MicroTCA are chassis standards geared to getting systems from telecomm, computing, military, medical and other companies to market faster and with lower cost. While the form factor, modularity and price point are attractive, thermal challenges can be magnified with the small form factors and interoperability challenges of a standard architecture. Attendees will be equipped with advanced, fast and accurate thermal design techniques that will help them efficiently use modeling and testing tools to determine device junction temperatures and speed time-to-market.

To register please visit our registration site here:
Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis

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Posted in Cabinet, Training, Webinar

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