With the advent of hybrid automobiles as well as high powered electronics, we are seeing more and more environments in which the heat flux in components is exceeding 1000w/c2. High heat transfer cooling mechanisms are needed to bring their junction temperatures to acceptable operating levels. One of the promising methods for high capacity cooling is boiling heat transfer. ATS Labs has put together a tutorial around that topic to provide a base level of information to help the thermal engineering professional and interested others understand this important topic. You can access it here:
Understanding Boiling Heat Transfer for Electronics Thermal Management
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