A headline like “maxiFLOW Heat Sink with superGRIP Heat Sink attach improves chip level Thermal Management” is a pretty bold statement but it’s one we stand behind at ATS. The reason has to do with the complicated vectors around making a heat sink work properly in a chip level application including how the fins are designed for proper airflow direction over the surface of the heat sink.
We developed maxiFLOW to actually channel the air properly down onto the heat sink and through it. The result of proper air flow management is better cooling, as depicted in these CFD outputs:
To get more information or to purchase maxiFLOW Heat Sinks with superGRIP attachment, click to our maxiFLOW web page at this link: ATS maxiFLOW/superGRIP Heat Sinks.