Clemens Lasance thoughts on the next generation challenges in electronics cooling

Mentor Graphics has a terrific interview with Clemens Lasance regarding a number of topics in the electronics cooling and thermal management industry. The interview, led by Mentor’s Robin Bornoff, covers a number of topics including:

  • Where he sees the biggest challenges in electronics cooling coming from in the future
  • The issue of the gap between thermal management as taught in academia and that practiced in the real world
  • What should software vendors supply in terms of capability to assist a thermal engineer?

Great reading, short and informative! You can check it out for yourself at this link, “An Interview with Clemens Lasance

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