Qpedia Thermal eMagazine, Volume 7, Issue 3, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues. 
Featured articles in this month’s issue include:
CFD Analysis of Synthetic Jets
In recent years, the synthetic jet has been studied widely and its characteristics have been compared to a continuous jet. The primary advantage of the synthetic jet is that it has no net mass flux, which eliminates the need for plumbing, and results in unique heat transfer effects on an impacting surface, not possible with steady or pulsed suction or blowing. However, the modeling of the formation and flow of a synthetic jet and heat transfer on an impinging surface present the greatest challenge for rapidly and accurately predicting performance of synthetic jet, and this subject is the focus of this article.
Cooling Solutions for 3D Stacked Chips
3D stacking of ICs has emerged as an extremely promising technology able to address the performance requirements of tomorrows high speed computing. This novel technology enables integration of logic, memory, RF and optoelectronic devices in a single chip [1]. Its advantages consist in reduced communication delays between functional modules, shorter interconnect lengths and reduced chip footprint and power dissipation. Nevertheless, even though it looks to be a very promising cooling approach, interlayer cooling using fluids should be regarded cautiously. Unless the heat flux to be removed is extremely high, alternative cheaper and safer methods should be used.
Industry Developments: Heat Sinks
Many types of electronics components have been engineered out over time, but not heat sinks. While devices continue to get smaller, faster and congested, managing heat is an ongoing necessity. Heat sinks continue to be the primary cooling solution in the electronics industry, and often the distinct solution in thousands of other applications. Heat sink designs have evolved, of course. Research and development continues, and some emerging heat sinks are now or soon-to-be available that offer new benefits for thermal engineers.
Technology Review: Manufacturing Heat Pipes, 1991 to 2008
In this issue our spotlight is on manufacturing heat pipes. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.
Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.
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