Author Archives: akoss

100th Issue of Qpedia Published!

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Qpedia Thermal eMagazine has just published its 100th Issue. Featured articles in this issue include:

Heat Sink Base Spreading Resistance Optimization for Achieving Better Thermal Performance

The goal of any electronic cooling solution is to lower the component junction temperature and thus maximize heat sink performance by reducing the spread resistance and fin resistance. This article will discuss an analytical model for how to select a heat sink so that maximum thermal performance can be achieved.

Rethinking Thermocouples: Creating Micro-Scale High Precision Sensors

Although thermocouples are suitable for standard thermal measurements, there can be a margin of error of 1°C. Sensors however, have an extremely fast response time to temperature changes allowing a measurement accuracy of 0.1°C. This article shows how using sensors instead of thermocouples is the optimal choice in certain thermal management situations.

Technical Note: Effect of Vacuum and Fill Ratio on the Performance of Heat Pipes

In this new section, Qpedia reviews fundamental thermal engineering principles, calculations and equations needed for the successful cooling of electronics. In this issue we discuss a heat pipe’s performance as a function of a liquid fill ratio and vacuum.

Industry Developments: Thermal Imaging Cameras

Though invisible to the eye, thermal radiation can be detected by thermal imaging cameras, also called thermographic or infrared cameras. In the engineering industry, these cameras allow one to view, pinpoint and analyze differing thermal patterns, including heat transfer and location of hot spots on a PCB, chip or any electronic device. This article reviews the latest developments and types of thermal imaging products available on the market.

Technology Review: Liquid Cooling Devices

Qpedia reviews innovative technologies developed for electronics cooling applications. This section presents selected patents that were awarded to developers around the world to address cooling challenges.In this issue our spotlight is on liquid cooling devices.

Cooling News

The latest technology, products, and news from around the electronics cooling industry.

Also included in this special issue is an editorial from Qpedia’s founder Dr. Kaveh Azar. Download the issue.

Qpedia Issue 98 Just Released

Qpedia, Issue 98, has just been released! Download the issue.

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Featured articles in this issue include:

COOLING IGBTS USING VAPORIZABLE DIELECTRIC FLUIDS

Dramatic increases in both power density and total power dissipation for power electronic systems, especially vehicle and airborne systems, together with demands for increased performance and speed of response, limit the application of a traditional forced convection air-cooled or a single phase liquid system. This article discusses how the newly developed Vaporizable Dielectric Fluid (VDF) cooling system, uses common dielectric refrigerants to effectively cool IGBT devices.

OPTIMAL HEAT SINK DESIGN FOR NATURAL CONVECTION IN VERTICAL ORIENTATION

Many tough-to-cool electronics applications don’t allow the use of fans, therefore heat sink solutions need to be optimized through natural convection. This article explores and compares the optimal design of traditional pin, straight fin and nontraditional heat sink designs in natural convection.

FUNDAMENTALS: HEAT PIPE HEAT TRANSPORT CAPABILITY

In this new section, Qpedia reviews fundamental thermal engineering principles, calculations and equations needed for the successful cooling of electronics. In this issue we discuss the heat transport capabilities and limitations of heat pipes.

INDUSTRY DEVELOPMENTS: MILITARY ELECTRONICS COOLING

Modern militaries around the world are equipped with very hot-running electronics that must reliably provide high levels of performance in critical situations. In addition, thermal management for military electronics can be extremely challenging, due to the strict size, weight and power (SWaP) requirements, rugged use, harsh environments, and cost restraints. This article presents recent cooling developments for military electronics.

TECHNOLOGY REVIEW: LED THERMAL MANAGEMENT

Qpedia reviews innovative technologies developed for electronics cooling applications. This section presents selected patents that were awarded to developers around the world to address cooling challenges. In this issue our spotlight is on thermal management systems for LED lighting.

COOLING NEWS

The latest products & technology from around the thermal management industry.

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How did you celebrate National Thermal Engineer Day?

National Thermal Engineer DayNational Thermal Engineer Day is a day celebrated on the National Day Calendar and sponsored by Advanced Thermal Solutions (ATS), dedicated to celebrating the importance of thermal management and the thermal engineers that cool the impossible. Thermal Engineers know the intricate science of heat flow and methods to provide cooling. They must account for every component in a device, how they all work together and where the device will be used. They use specialized equipment in dedicated thermal labs. They have training in electrical, mechanical and software engineering.

National Thermal Engineer Day

On August 24th ATS hosted the first annual “National Thermal Engineer Day” Celebration. Complete with food, gifts and the official Thermal Engineer Day Pin, ATS celebrates the thermal geek in you!

What?? You didn’t celebrate this year? Don’t worry! This is a National Holiday and plans are underway to make next years celebration even “hotter”.

To receive your FREE National Thermal Engineer Pin, email joday@qats.com.

Take pictures wearing your pin and email us or post to Facebook page using hashtag #ThermEngDay. Let us know where YOUR pin travels!

Stay tuned for this year’s exciting contests and Help ATS spread the Thermal News about Thermal Engineer Day!

Qpedia Issue 96 Just Published

Qpedia, Issue 96 has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues

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Featured articles include:

Using Integrated Planar Thermosyphon PCBs to Enhance Cooling of High Brightness LEDs

Because high brightness LEDs have a heat flux that reaches an excess of 80 W/cm2, thermal management is critical to ensure the LED properly performs. This article discusses the promising idea of improving the heat dissipation from the LED package to the PCB using thermosyphons. While the concept of a planar thermosyphon to enhance heat transfer by itself is not new, integrating it into a printed circuit board is innovative and appears to be a promising technology.

Nanofluids in Heat Pipes

The thermophysical properties of the working fluid have a direct impact on a heat pipe’s performance. Water is the most common and effective heat transfer fluid in the electronics cooling industry, but its properties can be enhanced by adding nano-particles. This article discusses what nanofluids are available and their benefits on a heat pipe’s performance.

Fundamentals: Effective Thermal Conductivity of a Heat Pipe

In this new section, Qpedia reviews fundamental thermal engineering principles, calculations and equations needed for the successful cooling of electronics. This issue we discuss how to identify the thermal conductivity of a heat pipe.

Industry Developments: Cooling COB LEDs

Chip-on-board (COB) LED’s are one of the most widely used types of LED packaging. However, the tight spacing between the LEDs and small light emitting surface that make COB LEDs attractive, also present high heat fluxes that must be addressed. Because COBs have such a small surface area, addressing power density is the primary challenge. This article reviews the recent methods that LED manufacturers are using to cool COB LEDs.

Technology Review: Phase Change Materials

Qpedia reviews innovative technologies developed for electronics cooling applications. This section presents selected patents that were awarded to developers around the world to address cooling challenges. In this issue our spotlight is on phase change materials.

Download Issue 96

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Why maxiFLOW Heat Sinks are the Best on the Market

ATS’s maxiFLOW heat sinks provide the highest thermal performance for the physical volume it occupies as compared to other heat sinks designs. The patented, flared fin design reduces junction temperatures by more than 20% compared to standard straight fin, pin fin, or folded fin designs. Watch the video to learn why maxiFLOW heat sinks are superior.

Want to learn more about maxiFLOW heat sinks? Click to the maxiFLOW Main Web Page

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