Category Archives: Heat Sinks

ATS Heat Sinks Offer Cooling for NVIDIA Jetson Modules for Embedded, Edge AI, and Robotics Applications

Posted on October 24, 2023 by | 3 comments

Advanced Thermal Solutions, Inc. (ATS) has introduced a family of heat sinks developed specifically for cooling NVIDIA® Jetson™ modules, widely used in robotics, embedded, and edge AI applications.

Each straight-fin, black anodized, aluminum heat sink comes with mounting screws or with a steel leaf spring and screws for secure through-hole mounting onto a PCB. Hole pattern guides are included. A high-performance thermal interface material (TIM) is pre-assembled on the attachment side of the heat sink.

The new heat sinks include passive (fanless) and active (fan-ready) options. Active heat sinks ship with hardware for attaching customer-selected fans to match performance needs. ATS includes a list of recommended fan suppliers.

Thermal resistance of these heat sinks is as low as 0.21°C/W and varies by size and active or passive configuration.

NVIDIA Jetson is a leading AI-at-the-edge computing platform with over a million developers. With pretrained AI models, software development kits and support for cloud-native technologies across the full Jetson lineup, manufacturers of intelligent machines and AI developers can build and deploy high-quality, software-defined features on embedded and edge devices targeting generative AI, robotics, AIoT, smart cities, healthcare, agriculture and farming, industrial applications, and more.

The new ATS heat sinks are designed to safeguard component life and performance of the full NVIDIA Jetson lineup of modules, from the high-performance NVIDIA Jetson AGX Orin™ to the compact yet powerful Jetson Nano™ series. ATS heat sinks for NVIDIA Jetson modules are available through Arrow Electronics and other authorized ATS distributors.

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Posted in Heat Sinks, NVIDIA, thermal management

CPU Coolers with TDP at 160W+ and Thermal Resistance of .012

Posted on May 6, 2022 by | 1 comment

ATS fanless, straight-fin heat sinks maximize system airflow for passive cooling of CPUs in a wide range of devices. These fanless, straight-fin heat sinks maximize system airflow to reliably cool high-performance processors at a lower cost than using heat sinks with fans. When attached with the available backing plate, these rugged heat sinks are usable on a wide variety of CPUs in industrial and commercial applications. Works with Intel, AMD, Nvidia CPUs, GPUs.

Available worldwide through our distribution network.

See the whole family here: ATS Fanless CPU Coolers.

Talk to one of our engineers on if our fanless High Performance Coolers are a good fit for your application, email us at: ats-hq@qats.com

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Posted in Air Cooling, Heat Sinks, Passive Cooling, thermal management

Edge Computing Applications Use Device Level Cooling to Ensure Performance and Reliability

Posted on February 9, 2022 by | Leave a comment

Edge computing devices are often installed environmentally severe and/or remote locations where reliable, long-term operation is essential. It is critical to thermally manage the CPUs, FPGAs, GPUs and other processing devices housed inside. Active cooling from ATS fanSINKs provides the cooling airflow continuously needed at the device level.

fanSINKs feature cross-cut, straight fins that maximize fan airflow for more efficient cooling. They are available for component packages from 27mm-84mm. Depending on their size, fanSINKs can be securely clipped onto a device with the ATS maxiGRIP attachment system, or with PEM screws or push pin hardware for direct attachment to the PCB. Smaller fanSINKs attach with maxiGRIP’s high performance plastic frame clip and 300 series stainless steel spring clip. The secure maxiGRIP attachment eliminates the need to drill holes in the PCB. Larger size fanSINKs fit tightly on components and attach firmly to the PCB with standoff and spring hardware.

Edge computing devices are often installed environmentally severe and/or remote locations where reliable, long-term operation is essential. It is critical to thermally manage the CPUs, FPGAs, GPUs and other processing devices housed inside. Active cooling from ATS fanSINKs provides the cooling airflow continuously needed at the device level. fanSINKs feature cross-cut, straight fins that maximize fan airflow for more efficient cooling. They are available for component packages from 27mm-84mm.

fanSINKs are pre-assembled with Chomerics T-412 thermal adhesive tape (smaller sizes), or with Chomerics T-766 phase change thermal interface material (larger sizes). These proven interface materials increase heat flow into the sinks to maximize cooling performance. Fans for use with fanSINKs are customer specified and provided.

fanSINKS can be purchased via ATS’s global distribution network, including Mouser and Digi-Key and Sager. Also, Sager provides customer specific value add of fans to meet customer application requirements.

==> Learn about our Edge Computing and Appliance fanSINKS at ATS’s website

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Posted in Fan, Fans, heat sink, Heat Sink Attach, Heat Sinks

dualFLOW Coolers – Airflow Video Show Airflow Pathway for Server CPU Cooling

Posted on January 13, 2022 by | 1 comment

dualFLOW coolers are used in dense systems with high-powered processors, e.g., CPUs, FPGAs and GPUs. They feature a straight fin heat sink base with a high-performance blower that pulls air across the device from two directions for enhanced cooling. ATS dualFLOW coolers provide at least 20% improvement in thermal performance compared to other CPU coolers on the market.

Click the image for a 10 second video on ATS’s YouTube channel showing how the
dualFLOW blower works

They fit standard Intel™ LGA2011 square or LGA2066 sockets, also known as Socket R. A PCB backing-plate is available for applications other socket types.


ATS PCB backing-plate is available for applications other than socket LGA Socket 2011 and LGA Socket 2066 (FPGA, GPU, etc.). Part number ATS-HK379-R0.

dualFLOW models include aluminum or copper fins, and a vapor chamber base to match with needed thermal performance or weight restrictions.

==> Learn more about dualFLOW on qats.com https://www.qats.com/eShop.aspx?q=Ultra-Cool%20High-Power%20Device%20Coolers

==> Wondering if dualFLOW is right for your application? Email our engineering team to ask: ats-hq@qats.com

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Posted in Active, cooling, Heat Sinks

fanSINK Line Expanded by ATS, Footprints Now 27mm x 84mm

Posted on October 22, 2021 by | Leave a comment

Does your design need cooling for hot components not getting enough air or have components that simply need spot cooling?

The ATS fanSINK line is now available in sizes from 27mm to 84mm. Engineers can now easily add industry leading thermal management across a very wide set of component footprints.

Available from ATS distribution partners now or learn more at:
* Video (1:48) https://www.youtube.com/watch?v=uCRvNPI8clk
* Website: https://www.qats.com/eShop.aspx?productGroup=0&subGroup=2&q=fanSINK

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Posted in Fan, Fans, heat sink, Heat Sink Attach, Heat Sinks

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