Category Archives: Webinar

The use of liquid cooling systems is becoming more practical and effective for managing skyrocketing increases in power dissipation. But how do you decide when you need to cool with liquid? How do you find the right liquid cooling system for your application? This webinar provides the best practices for implementing a liquid cooling system at the device level.

ATS’ Engineering eBook on Liquid Cooling will be provided to those who register. During the webinar, a download button will allow attendees to get the eBook.

This webinar is pre-recorded and presented by ATS founder and CEO, Dr. Kaveh Azar.

WHEN: June 23, 2022 2PM EST

Advanced Thermal Solutions, Incl, (ATS) Free Engineering Webinar on Thermal Management of Telecomm and Datacomm Equipment being held Thursday, March 17th, 2PM EST. This is a free engineering webinar.

With digital infrastructure, a reality, the distinctions between telecom and datacom equipment are very little. Now, the communications infrastructure includes wireless communication over cellular, SaaS, IaaS, PaaS, cloud storage, WiFi, remote computing, and more. In the next 60 minutes, Dr. Kaveh Azar will address power trends, standards, thermal design challenges, cooling options, and the thermal design process all for the communications infrastructure space. Attendees will understand more about these topics and how to apply them in the communications infrastructure.

This webinar, presented by thermal management expert Dr. Kaveh Azar, Ph.D., will address all these issues and more. The webinar is one hour in length with time for questions and answers afterwards online and after the webinar concludes.

===>>Engineering Webinar: Electronics Cooling Technologies Update: The Evolution of Thermal Management

When: Thursday January 20th 2PM EST

Register: https://bit.ly/GotowebinarATS

Length: 60 minutes + 30 min. Q&A

What is this about: The market is saturated with cooling options for thermally managing electronic systems. Choosing the right cooling solution is a challenging task for engineers who are not actively involved in thermal management. This webinar reviews all market current cooling options and their most important features. This webinar will help engineers navigate through the maze of solutions that work and those that are just hype.

Who should attend:

Practicing engineers who want a strong overview of what’s new in the cooling market

Technical professionals who want to understand the capabilities and limitations of various thermal management options

Engineers who have questions about current solutions they are considering

We’ll be hosting another of our monthly webinar on 4-15-21 at 2 PM EST. This one covers how to choose the right heat sink attachment for component packages of all sizes and shapes. Our speaker will be Product Engineering Manager, Greg Wong.

Choosing the right heat sink is part of deploying a good thermal management solution, the other part is the attachment method. Whether clip, push pin, z-clip, or other, the attachment has an important impact on how effective the thermal solution is. This webinar will cover these issues including attachments for rectangular packages increasingly used in SoC and SiP packages. A handy technical reference sheet and white paper on attachment types will be provided to those who register. This webinar, presented by ATS Product Engineering Manager, Greg Wong and will address all these issues and more. The webinar is 30 minutes in length with time for questions and answers afterward online and after the webinar concludes. The webinar is no charge to attend, but, we do ask you to register: