After ATS thermal analysis, the final layout of the board included the XLP processor downstream from the other components. (Advanced Thermal Solutions, Inc.)
Innovation in Thermal Management
- ATS Home Page
- ATS Products
- FOLLOW ATS
- About
- Technical Resources
- Industrial, Lab & Manufacturing Immersion and Recirculating Chillers
- ATS Full Literature Kit & Product Application Guide
- ATS Engineering eBooks
- Engineering White Papers
- fanSINK Deployment in a System: How System Flow Affects Fan Sink Performance
- How to Select a Peltier Cooler for Cooling or Heating Electronics
- Liquid Cooling Systems and their Components: An Introduction
- Clips, Screws or Glue? Heat Sink Attachment Technical Brief
- Measuring Thermal Resistance of Minichannel Cold Plates
- How to Analyze Heat Transfer of Compact Heat Exchangers
- An ATS “How To” On Implementing Liquid Cooling
- ATS has their hands on SFP modules
- Heat Pipe Optimization White Paper
- How to Measure Airflow in Complex Systems
- Thermal Engineering Kits
- Air Jet Impingement “How To” Technical Library
- Heat Sink Material Reference Kit
- LED Cooling Design Kit
- Sensor Quick Reference
- Product and How To Video Series
- Case Study: Cabinet Cooling Using Water and Refrigeration System
- ATS Engineering Webinar: Heat Sink Selection Made Easy
- The Effect of Compact PCB Layout on Thermal Management
- National Thermal Engineer Day
- Case Studies
- Customer Feedback
Proudly powered by WordPress.
Theme: Coraline by WordPress.com.