ATS has released a Consulting Project Subscription Plan (CPSP) for engineering services. From our corporate headquarters in Norwood, Massachusetts,we offers comprehensive thermal management analysis and design services for the telecommunications, medical, military, defense, aerospace, automotive, and embedded computing industries. The new plan allows ATS engineers to become an extension of your team for a pre-determined amount of hours, providing expert thermal and mechanical engineering consultation, design, simulation, testing and validation.
Services include Design, Simulation, Testing, Analysis & Prototyping
The CPSP includes the use of ATS thermal lab facilities and covers all projects approved by an authorized representative of subscribed customers. ATS thermal management analysis and design services encompass both experimental and computational simulations using proprietary tools and computational fluid dynamics software packages such as FLOTHERM and CFdesign.
Thermal Testing & Analysis
The new subscription plan gives customers priority access to ATS engineering and manufacturing resources for all chip, board, enclosure, and system related projects. ATS studies the full packaging domain, including components, circuit boards (PCBs), shelves, chassis, and system packaging.
Consulting capabilities include:
– heat sink, board and fan characterization
– heat sink design and optimization
– PCB & fan tray design and optimization
– liquid cooling design
– prototyping of heat sinks and complete cooling systems
– wind tunnel testing of components, PCBs, chassis and enclosures
ATS offers rapid prototyping of machined parts and cooling systems from its US facilities. Sheet metal fabrication and cut heat sink prototypes are quickly provided from international partners.
Liquid Crystal Thermography
ATS believes that customers who wish to remain competitive should consider a design-to-suit opportunity solution first. Contrary to common perception, this proves to be less expensive to the customer in the long run, because of the ensuing gain in product efficiency and compatibility. Working side-by-side with customers worldwide, ATS engineers provide tailored solutions to thermal and mechanical packaging challenges on real projects with real schedules.
To learn more about the consulting project subscription plan, call 781-769-2800, email ats-hq@qats.com, or visit www.qats.com.
Advanced Thermal Solutions, Inc., (ATS), is now officially in active status with the United States Federal Governments System for Award Management (SAM). The System for Award Management (SAM) is the Official U.S. Government system that consolidated the capabilities of CCR/FedReg, ORCA, and EPL, for vendors doing business with the Federal government.