Tag Archives: engineering design

ATS Offers Arrow Customers a Half-Day of Free Access to its Thermal Characterization Lab

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As part of the new distribution agreement between Arrow Electronics and Advanced Thermal Solutions, Inc., ATS is offering a half-day of free, no-obligation use of its unique Thermal Characterization Laboratory to Arrow customers. The Thermal Characterization Lab, located at ATS headquarters in Norwood, MA, allows engineers to perform thermal testing on heat sinks, fans and fan trays, PCBs, blades, enclosures, or complete systems. Experienced engineers, board and system designers can perform the tests themselves, or consult with an ATS thermal engineer at no cost during their 4 hours of laboratory time.

ATS’ Thermal Characterization Lab features a full range of research-quality instruments, including open and closed loop wind tunnels, for ambient and elevated temperature testing, all with PC-driven controls and automated data collection. The lab is also outfitted with a full array of the company’s sensor systems and thermocouples, which can be used to characterize electronic products under variable airflow and temperature conditions.

Liquid Crystal Thermography

In addition, the lab also features a JEDEC approved component thermal testing facility for conducting multitude of device level testing per JEDEC standards. The facility also provides a complete liquid crystal and IR thermography systems for non-invasive temperature mapping to 0.1oC with one micron-level spatial resolution; and a liquid cooling facility for complete testing and characterization of cold-plates, cooling effect and proof of concept testing.

 

“Most of today’s electronics have thermal situations that can turn into big problems if left alone. The easiest, lowest cost way to manage this is to conduct an accurate thermal characterization of the problem at hand,” said Kaveh Azar, Ph.D., President and CEO of Advanced Thermal Solutions, Inc. “If you have the right facility and associated know-how, you can often complete your test in a half-day, then you can readily assess what is the best thermal solution for your application. For engineers short on time and resources, we believe this free use of ATS’ Thermal Characterization Lab could be very helpful.”

Download the Brochure

To contact ATS for more information on this opportunity, please call 781-769-2800, email ats-hq@qats.com or visit www.qats.com.

2013 Webinar Calendar Released

ATS will provide two free technical webinars each month in 2013. Presented by PhD-level thermal engineers, each event will focus on an important area of electronics thermal management. The tutorials will provide practical training and insights for all engineers, designers and program managers who want to learn more about electronics cooling.

Most of the ATS webinars are scheduled to run no longer than 15 minutes in respect to the time demands on todays engineers. But each quarter of 2013 will conclude with a one-hour event that presents deeper training on a crucial heat management topic.

Every webinar is free of charge. Attendees can submit questions during the live presentations. For later viewing, each webinar will be archived on the ATS website for free streaming at the engineers convenience. Questions and comments to the recorded webinars will be responded to by ATS engineers.

ATS Webinars

Here are the 2013 ATS webinar dates, run times and titles:

Jan 9: What is the Thermal Management of Electronics?

Jan 23: Thermal Interface Material Overview: Pros and Cons

Feb 13: Calculating Junction Temperature in Electronics Cooling

Feb 27: Important Factors When Doing Heat Sink Design

Mar 13: Analytical Modeling for Thermal Analysis

Mar 27: Heat Sink Materials: Choices and Tradeoffs

Apr 10: LED Cooling: Whats So Hot about LEDs?

Apr 24: LED Cooling: Analytical Thermal Analysis

May 8: LED Cooling: Computational Thermal Analysis

May 22: LED Cooling: Physical Thermal Analysis

Jun 12: Heat Sink Fin Spacing for Heat Transfer Optimization

Jun 26: Temperature Measurements Within Electronic Systems

Jul 10: Heat Sink Types: Pros and Cons

Jul 24: Heat Sink Manufacturing Processes

Aug 14: Thermal Conductivity: What It Is and Why You Should Care

Aug 28: How to Perform Pressure Drop Calculations

All webinars are on Wednesdays at 2pm. Please visit www.qats.com/training to view the entire list of webinars, on-demand webinars in the archive, and to register for the full hour, live tutorials.

Holiday Sale: 25 % Off Qpedia Book Series!

 

coolingZONE is running a holiday promotion on the Qpedia Book Series, discounting 25% off the normal retail value until December 31, 2012. Qpedia Thermal eMagazine is the official media sponsor of coolingZONE. The Qpedia book series provides an expert resource for engineering professionals, professors, students and others who want to learn more about the theories and applications of electronics thermal management.

The four volume set contains nearly 200 in-depth articles, researched and written by veteran engineers. They address the most critical areas of electronics cooling, with a wide spectrum of topics and thorough technical explanation. Each article features color illustrations and images along with important thermal calculations and formulas.

Qpedia Volume 1 topic highlights:

– Heat sink design

– Pool boiling

– Sensors

– Thermal chassis

– Pitot tubes

– Heat transfer

Qpedia Volume 2 topic highlights:

– Thermal grease

– Vapor chamber cooling

– Liquid cooling

– Natural convection cooling

– Phase change materials

Qpedia Volume 3 topic highlights:

– CFD modeling

– PCB optimization

– Jet impingement cooling

– LED cooling

– Cold plates

– Refrigeration systems

Qpedia Volume 4 topics highlights:

– Multilayer mini-channel heat sinks

– Electro-osmotic pumps

– Thermoelectric coolers

– High altitude heat transfer

– Data center cooling

– Defense electronics

– Automotive electronics cooling

Check out the video on Qpedia Volume 4

Over fifteen thermal and mechanical engineers combined their expertise to create the articles in this useful collection, including Kaveh Azar, Ph.D. and Bahman Tavassoli, Ph.D., both of whom are internationally recognized experts in the field of the thermal management of electronics. Qpedia Thermal eMagazine, published by Advanced Thermal Solutions, Inc. (ATS) was launched in 2007 as a technical publication dedicated to the thermal management of electronics.

Filled with careful explanations, step-by-step calculations, and practical examples from real life challenges, this expert collection of articles is a must have for any mechanical, electrical, and thermal engineer or anyone interested in the rapidly growing field of electronics cooling.

Order the Qpedia Book Series with 25% off now at www.coolingzone.com The books can be purchased as a complete set, combination, or individually. Volume discounts for organizations and academic institutions are also available.