Tag Archives: engineering education

Digital News Gets Support from ATS

With Thermal Engineer day approaching (7/24) we here at ATS would like to thank all of the PR firms and digital news magazines who covered our new clipKIT campaign.

thermal technology - digital news - electronics businessAs a token of our appreciation, we have provided a link to our customers and viewers to download our clipKIT data sheet for all your attachment needs. HERE.

 

Free Webinar this Thursday on the “Thermal Management of Consumer Electronics”

From the basic science of thermal energy, to diagnosing and resolving difficult heat issues, ATS engineers share their knowledge with audiences throughout the year with our free webinar series.

Our next webinar will be this Thursday, August 8 at 2pm ET on the “Thermal Management of Consumer Electronics.”

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Consumer electronics are now being used in places that were once exclusive to business and military electronics. Products like Apple’s iPhone and iPad are sophisticated technologies with powerful processors housed in small spaces with restricted airflow. As a result, these devices, and others like them, are providing many new benefits, but they also bring higher thermal management needs. Attendees will learn the available cooling options, and important factors such as the importance of spreading resistance in component and system thermal management.

The prerecorded webinar is free but seating is limited. Register Now.

Qpedia is Hot of the Press

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Qpedia Thermal eMagazine, Volume 7, Issue 5, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

Featured articles in this issue include:

Next Generation Processor Cooling and Power Trends

CMOS semiconductor technology has been faithfully following Moore’s Law for several decades now. This Law states that the number of transistors per unit area doubles about every year [1]. This trend is likely to continue in the foreseable future. In addition, two other technical trends will accompany the roadmap of future processors: manycore chip multiprocessors and 3D integration. This article presents a review of recent predictions for future 2D and 3D manycore processors architectures.

Thermal Performance of Thin Flat Heat Pipes

As the demands for faster, smaller and multifunctional mobile devices, such as cell phones, PDAs, and netbooks, keep increasing, both system and electronic engineers are trying to integrate more functional models into smaller and thinner devices. This has forced thermal engineers into looking for more innovative and effective passive methods to cool semiconductor devices with their increasing power density. Thin flat heat pipes, whose thickness is less than 1.5 mm, have found more applications on mobile devices and certainly drawn more attention from researchers.

Industry Developments: Smartphone Cooling Systems

With increasingly processor-intensive apps being used on mobile devices, the steadily powerful chipsets in smartphones are running hotter than ever. Many desktop computers and larger, powerful computing systems use water cooling to keep their CPUs from overheating. Now smaller versions of these cooling systems are being employed in warm smart phones. While NEC was the first major smartphone company to launch a liquid-embedded smartphone, other manufacturers, such as Apple, Samsung Electronics and HTC are likely to soon follow in 2013.

Technology Review: Air Delivery Systems Utilizing Piezofan or Standard Fans

In this issue our spotlight is on air delivery systems using piezo and standard fans. There is much discussion about this and these patents show some of the salient features that are the focus of different inventors.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

Next Webinar: Thursday, July 18 @ 2pm ET

ATS Webinar

Don’t miss the next ATS webinar, “Using Thermal Interface Materials to Improve Heat Sink Thermal Performance”.

This is a free, pre-recorded webinar that will be held at 2pm ET on Thursday July 18th. Attendees will gain a much better understanding on what thermal interface materials are, how they function and how to best use them. The pros and cons of various thermal interface materials is also discussed. This class is from the perspective of the engineer who uses the material not one of the thermal interface material suppliers themselves.

There is no fee to attend, but virtual seating is limited so Register Now

New Qpedia Thermal eMagazine Published!

Qpedia Thermal eMagazine, Volume 6, Issue 11, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues. Featured articles in this month’s issue include:

Honeycomb Heat Sinks for LEDs

LEDs, or light-emitting diodes, are a form of solid-state lighting. An LED light is often made of a small piece of semiconductor, an integrated optical lens used to shape its radiation pattern, and a heat sink, used to dissipate heat and maintain the semiconductor at low operating temperature. LED lights present many advantages over incandescent light sources, including lower energy consumption, longer lifetime, improved physical robustness, smaller size and faster switching. This article examines Ma et al’s  findings with respect to the honeycomb heat sink design employed in LEDs, which has proven to be highly efficient.

Characteristics of Thermosyphons in Thermal Management

With the increase of heat fluxes and shrinking chip sizes in electronics applications, there is a need to spread the heat from the small chip to the larger heat sink or to transport the heat to a location where there is ample space to remove the heat. Heat pipes, vapor chambers and thermosyphons have been introduced to undertake this task and, in this article, we focus on some aspects of the design of thermosyphons. The advantage of thermosyphons is that they have no capillary limit and can transport large amounts of heat over long distances.

Industry Developments: Heat Pipes Providing High Performance

Heat pipes are increasing in type and use for the benefits they provide. Because of their lower total thermal resistance, heat pipes transfer heat more efficiently and evenly than solid aluminum or copper. Heat pipes contain a small quantity of working fluid (e.g. water, acetone, nitrogen, methanol, ammonia). Learn the conclusions of a recent study that focused on the best working fluid and another study of heat pipes in outer space.

Technology Review: Cold Plates, 2010 to 2012

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.