Tag Archives: engineering education

Holiday Sale: 25 % Off Qpedia Book Series!

 

coolingZONE is running a holiday promotion on the Qpedia Book Series, discounting 25% off the normal retail value until December 31, 2012. Qpedia Thermal eMagazine is the official media sponsor of coolingZONE. The Qpedia book series provides an expert resource for engineering professionals, professors, students and others who want to learn more about the theories and applications of electronics thermal management.

The four volume set contains nearly 200 in-depth articles, researched and written by veteran engineers. They address the most critical areas of electronics cooling, with a wide spectrum of topics and thorough technical explanation. Each article features color illustrations and images along with important thermal calculations and formulas.

Qpedia Volume 1 topic highlights:

– Heat sink design

– Pool boiling

– Sensors

– Thermal chassis

– Pitot tubes

– Heat transfer

Qpedia Volume 2 topic highlights:

– Thermal grease

– Vapor chamber cooling

– Liquid cooling

– Natural convection cooling

– Phase change materials

Qpedia Volume 3 topic highlights:

– CFD modeling

– PCB optimization

– Jet impingement cooling

– LED cooling

– Cold plates

– Refrigeration systems

Qpedia Volume 4 topics highlights:

– Multilayer mini-channel heat sinks

– Electro-osmotic pumps

– Thermoelectric coolers

– High altitude heat transfer

– Data center cooling

– Defense electronics

– Automotive electronics cooling

Check out the video on Qpedia Volume 4

Over fifteen thermal and mechanical engineers combined their expertise to create the articles in this useful collection, including Kaveh Azar, Ph.D. and Bahman Tavassoli, Ph.D., both of whom are internationally recognized experts in the field of the thermal management of electronics. Qpedia Thermal eMagazine, published by Advanced Thermal Solutions, Inc. (ATS) was launched in 2007 as a technical publication dedicated to the thermal management of electronics.

Filled with careful explanations, step-by-step calculations, and practical examples from real life challenges, this expert collection of articles is a must have for any mechanical, electrical, and thermal engineer or anyone interested in the rapidly growing field of electronics cooling.

Order the Qpedia Book Series with 25% off now at www.coolingzone.com The books can be purchased as a complete set, combination, or individually. Volume discounts for organizations and academic institutions are also available.

Q4 Webinars Now Open for Registration

ATS, Advanced Thermal Solutions, Inc. just announced the final three webinars that will be presented as part of the 2012 webinar series. These free technical presentations, tought by leading experts in the industry, provide engineering-level training in key areas of thermal management in electronics cooling.

The following list provides the webinar topics, dates, and registration info:

LED Thermal Management in Commercial and Consumer Lighting Applications
Why does thermal management matter? Excess heat directly affects both short-term and long-term LED performance. The short-term effects are color shift and reduced light output while the long-term effect is accelerated lumen depreciation and thus shortened useful life. Participants will learn how to diagnose and solve thermal issues in consumer and commercial LED applications.

Thursday, October 25, 2012 at 2:00 p.m. (EST)

Register Now

Natural Convection Cooling: Optimizing Heat Sink Fin Spacing and More for Heat Transfer

Most high-powered electronic devices are cooled by forced convection airflow, but occasionally there is a need for natural convection cooling. Determining factors, which include cost, noise, vibration and reliability, can cause the need to eliminate the use of a fan or blower, particularly in consumer electronics and outdoor enclosures. Attendees will learn more about how to implement natural convection cooling, how to optimize for fin spacing and other important design elements for a successful thermal management solution.

Thursday, November 15, 2012 at 2:00 p.m. (EST)

Register Now

Heat Pipes and Vapor Chambers in Heat Transfer
As electronics become faster and more powerful, thermal solutions must evolve to deal with the increasing heat loads. Simply increasing the size of a heat sink, or adding a fan, was once enough to provide the required increased performance. Liquid cooling through the use of heat pipes, vapor chambers and microchannels can be excellent solutions in these high heat applications. Attendees will learn how to deploy heat pipes and vapor chambers in thermal management, including the use of microchannels.

Thursday, December 13, 2012 at 2:00 p.m. (EST)

Register Now

To learn more about ATS Webinar and Training events, visit: http://www.qats.com/Training