Tag Archives: heat pipe

What are Heat Pipes and What Characteristics Make Them Helpful for Electronics Cooling?

Heat Pipes, the Super Conductors
Heat pipes are transport mechanisms that can carry heat fluxes ranging from 10 W/cm2 to 20 KW/cm2 at a very fast speed. Essentially, they can be considered as heat super conductors. Heat pipes can be used either as a means to transport heat from one location to another, or as a means to isothermalize the temperature distribution.

The first heat pipe was tested at Los Alamos National Laboratory in 1963. Since then, heat pipes have been used in such diverse applications as laptop computers, spacecraft, plastic injection molders, medical devices, and lighting systems. The operation of a heat pipe is described in Figure 1.


Figure 1. Schematic View of a Heat Pipe [1].

A heat pipe has three sections: the evaporator, adiabatic, and condenser. The interior of the pipe is covered with a wick, and the pipe is partially filled with
a liquid such as water. When the evaporator section (L ) is exposed to a heat source, the liquid inside vapor- izes and the pressure in that section increases. The increased pressure causes the vapor to flow at a fast speed toward the condenser section of the heat pipe (L ). The vapor in the condenser section loses heat to the integral heat sink and is converted back to liquid by the transfer of the latent heat of vaporization to the condenser. The liquid is then pumped back to the evaporator through the wick capillary action. The middle section
of the heat pipe (La), the adiabatic portion, has a very small temperature difference.

figure2Figure 2. Pressure Drop Distribution in a Heat Pipe [1].

Figure 2 shows the pressure drop distribution inside a heat pipe. In order for the capillary force to drive the vapor, the capillary pressure of the wick should exceed the pressure difference between the vapor and the liquid at the evaporator. The graph also shows that if the heat pipe is operated against the force of gravity, the liquid undergoes a larger pressure drop. The result
is less pumping of the wick with reduced heat transfer. The amount of heat transfer decrease depends on the particular heat pipe.

figure3Figure 3. Different Wick Structures

A typical heat pipe is made of the following:
1. Metallic pipe  The metal can be aluminum, copper or stainless steel. It must be compatible with the working fluid to prevent chemical reactions, such as oxidation.

2. Working fluid  Several types of fluids have been used to date. These include methane, water, ammonia, and sodium. Choice of fluid also depends on the
operating temperature range.

3. Wick  The wick structure comes in different shapes and materials. Figure 3 shows the profiles of common wick types: axial groove, fine fiber, screen mesh, and sintering. Each wick has its own characteristics. For example, the axial groove has good conductivity, poor flow against gravity, and low thermal resistance. Conversely, a sintering wick has excellent flow in the opposite direction of gravity, but has high thermal resistance.

Table 1. Heat Pipes with Different Structures and Operating Conditions [1]table1Table 1 shows experimental data for the operating temperature and heat transfer for three different types of heat pipes [1].

Certain factors can limit the maximum heat transfer rate from a heat pipe.

These are classified as follows:
1. Capillary limit
  Heat transfer is limited by the pumping action of the wick.
2. Sonic limit  When the vapor reaches the speed of sound, further increase in the heat transfer rate can only be achieved when the evaporator temperature
increases.
3. Boiling limit  High heat fluxes can cause dry out.
4. Entrainment limit  High speed vapor can impede the return of the liquid to the condense.

A heat pipe has an effective thermal conductivity much larger than that of a very good metal conductor, such as copper. Figure 4 shows a copper-water heat pipe and a copper pipe dipped into an 80°C water bath. Both pipes were initially at 20°C temperature. The heat pipe temperature reaches the water temperature in about 25 seconds, while the copper rod reaches just 30°C after 200 seconds. However, in an actual application when a heat pipe is soldered or epoxied to the base of a heat sink, the effective thermal conductivity of the heat pipe may be drastically reduced due to the extra thermal resistances added by the bonding. A rule of thumb for the effective thermal conductivity of a heat pipe is 4000 W/mK.

figure4
Figure 4. Experiment Comparing Speed of Heat Transfer Between a Heat Pipe and a Copper Pipe [1].

Heat pipe manufacturers generally provide data sheets showing the relationship between the temperature difference and the heat input. Figure 5 shows the temperature difference between the two ends of a heat pipe as a function of power [2].

figure5Figure 5. Temperature Difference Between the Evaporator and the Condenser in a Heat Pipe [2].

figure6Figure 6. Typical Round Heat Pipes in the Market.

There are many heat pipe shapes in the market, but the most common are either round or flat. Round heat pipes can be used for transferring heat from one point to another. They can be applied in tightly spaced electronic components, such as in a laptop. Heat is transferred to a different location that provides enough space to use a proper heat sink or other cooling solution. Figure 6 shows some of the common round heat pipes available in the market.

Flat heat pipes (vapor chambers) work conceptually the same as round heat pipes. Figure 7 shows a flat pipe design, they can be used as heat spreaders. When the heat source is much smaller than the heat sink base, a flat heat pipe can be embedded in the base of the heat sink, or it can be attached to the base to spread the heat more uniformly on the base of the heat sink. Figure 8 shows some common flat heat pipes.

figure7Figure 7. Conceptual Design Schematic of a Flat Heat Pipe [1].

 

figure8Figure 8. Commonly-used Flat Heat Pipes.

Although a vapor chamber might be helpful in minimizing spreading resistance, it may not perform as well as a plate made from a very high conductor, such as diamond. A determining factor is the thickness of the base plate. Figure 9 shows the spreading resistance for 80 x 80 x 5 mm base plate of different materials with a 10 x 10 mm heat source. The vapor chamber has a spreading resistance that is better than copper, but worse than diamond. However the price of the diamond might not justify its application. Figure 9 also includes the spreading
resistance from the ATS Forced Thermal Spreader (FTS), which is equal to that of diamond at a much lower cost. The FTS uses a combination of mini and
micro channels to minimize the spreading resistance by circulating the liquid inside the spreader.

figure9Figure 9. Thermal Spreading Resistances for Different Materials. [3] – ATS

Heat pipes have a very important role in the thermal management arena. With projected lifespans of 129,000-260,000 hours (as claimed by their manufacturers), they will continue to be an integral part of some new thermal systems. However, with such problems as dry out, acceleration, leakage, vapor lock and reliable performance in ETSI or NEBS types of environments, heat pipes should be tested prior to use and after unsatisfactory examination of other cooling methods.

References:
1. Faghri, A. Heat Pipe Science and Technology Taylor & Francis, 1995.
2. Thermacore Internation, Inc., www.thermacore.com.
3. Xiong, D., Azar, K., Tavossoli, B., Experimental Study on a Hybrid Liquid/Air Cooling System, IEEE, Semiconductor Thermal Measurement and Management Symposium 2006.

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New Qpedia Thermal eMagazine Published!

Qpedia Thermal eMagazine, Volume 6, Issue 11, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues. Featured articles in this month’s issue include:

Honeycomb Heat Sinks for LEDs

LEDs, or light-emitting diodes, are a form of solid-state lighting. An LED light is often made of a small piece of semiconductor, an integrated optical lens used to shape its radiation pattern, and a heat sink, used to dissipate heat and maintain the semiconductor at low operating temperature. LED lights present many advantages over incandescent light sources, including lower energy consumption, longer lifetime, improved physical robustness, smaller size and faster switching. This article examines Ma et al’s  findings with respect to the honeycomb heat sink design employed in LEDs, which has proven to be highly efficient.

Characteristics of Thermosyphons in Thermal Management

With the increase of heat fluxes and shrinking chip sizes in electronics applications, there is a need to spread the heat from the small chip to the larger heat sink or to transport the heat to a location where there is ample space to remove the heat. Heat pipes, vapor chambers and thermosyphons have been introduced to undertake this task and, in this article, we focus on some aspects of the design of thermosyphons. The advantage of thermosyphons is that they have no capillary limit and can transport large amounts of heat over long distances.

Industry Developments: Heat Pipes Providing High Performance

Heat pipes are increasing in type and use for the benefits they provide. Because of their lower total thermal resistance, heat pipes transfer heat more efficiently and evenly than solid aluminum or copper. Heat pipes contain a small quantity of working fluid (e.g. water, acetone, nitrogen, methanol, ammonia). Learn the conclusions of a recent study that focused on the best working fluid and another study of heat pipes in outer space.

Technology Review: Cold Plates, 2010 to 2012

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

What is a Heat Pipe and How Does it work in Thermal Management? (part 2 of 2)

We’re concluding a two part series today on what a heat pipe is and how it works in thermal management. In part one we talked about what a heat pipe is and the anatomy of a heat pipe. Here in part 2 we’ll conclude with factors that can limit a heat pipes effectiveness, differences in the thermal performance of various heat pipe types, and the spreading resistance of different materials.

Table 1 shows experimental data for the operating temperature and heat transfer for three different types of heat pipes [1].

Heat Pipes With Different Constructions and Operating ConditionsTable 1: Heat Pipes with Different Structures and Operating Conditions [1]

Certain factors can limit the maximum heat transfer rate from a heat pipe. These are classified as follows:

  1. Capillary Limit: Heat transfer is limited by the pumping action of the wick
  2. Sonic Limit: When the vapor reaches the speed of sound, further increase in the heat transfer rate can only be achieved when the evaporator temperature increases
  3. Boiling Limit: High heat fluxes can cause dry out.
  4. Entrainment Limit: High speed vapor can impede the return of the liquid to the condenser

A heat pipe has an effective thermal conductivity much larger than that of a very good metal conductor, such as copper. Figure 4 shows a copper-water heat pipe and a copper pipe dipped into an 80oC water bath. Both pipes were initially at 20oC temperature. The heat pipe temperature reaches the water temperature in about 25 seconds, while the copper rod reaches just 30oC after 200 seconds. However, in an actual application when a heat pipe is soldered or epoxied to the base of a heat sink, the effective thermal conductivity of the heat pipe may be drastically reduced due to the extra thermal resistances added by the bonding. A rule of thumb for the effective thermal conductivity of a heat pipe is 4000 W/mK.

Experiment Comparing Speed of Heat Transfer Between a Heat Pipe and a Copper PipeFigure 4. Experiment Comparing Speed of Heat Transfer Between a Heat Pipe and a Copper Pipe [1].

Heat pipe manufacturers generally provide data sheets showing the relationship between the temperature difference and the heat input. Figure 5 shows the temperature difference between the two ends of a heat pipe as a function of power [2].

Temperature Difference Between the Evaporator and the Condenser in a Heat PipeFigure 5. Temperature Difference Between the Evaporator and the Condenser in a Heat Pipe [2]

There are many heat pipe shapes in the market, but the most common are either round or flat. Round heat pipes can be used for transferring heat from one point to another. They can be applied in tightly spaced electronic components, such as in a laptop. Heat is transferred to a different location that provides enough space to use a proper heat sink or other cooling solution. Figure 6 shows some of the common round heat pipes available in the market.

Typical Round Heat Pipes in the Market.Figure 6. Typical Round Heat Pipes in the Market.

Flat heat pipes (vapor chambers) work conceptually the same as round heat pipes. Figure 7 shows a flat pipe design, they can be used as heat spreaders. When the heat source is much smaller than the heat sink base, a flat heat pipe can be embedded in the base of the heat sink, or it can be attached to the base to spread the heat more uniformly on the base of the heat sink. Figure 8 shows some common flat heat pipes.

Conceptual Design Schematic of a Flat Heat Pipe

Figure 7. Conceptual Design Schematic of a Flat Heat Pipe

Commonly Used Flat Heat PipesFigure 8. Commonly-used Flat Heat Pipes

Although a vapor chamber might be helpful in minimizing spreading resistance, it may not perform as well as a plate made from a very high conductor, such as diamond. A determining factor is the thickness of the base plate. Figure 9 shows the spreading resistance for 80 x 80 x 5 mm base plate of different materials with a 10 x 10 mm heat source. The vapor chamber has a spreading resistance that is better than copper, but worse than diamond. However the price of the diamond might not justify its application. Figure 9 also includes the spreading resistance from the ATS Forced Thermal Spreader (FTS), which is equal to that of diamond at a much lower cost. The FTS uses a combination of mini and micro channels to minimize the spreading resistance by circulating the liquid inside the spreader.

Thermal Spreading Resistances for Different Materials
Figure 9. Thermal Spreading Resistances for
Different Materials.

Heat pipes have a very important role in the thermal management arena. With projected lifespans of 129,000-260,000 hours (as claimed by their manufacturers), they will continue to be an integral part of some new thermal systems. However, with such problems as dry out, acceleration, leakage, vapor lock and reliable performance in ETSI or NEBS types of environments, heat pipes should be tested prior to use and after unsatisfactory examination of other cooling methods have been explored.

That ends our two part series on heat pipes. Have you got a question on heat pipes or their application? How about an interest in bringing ATS’s team of experienced thermal engineers into one of your projects? You can reach us by visiting http://www.qats.com Purchase heat sinks through our Heat Sink eShop or email us at ats-hq@qats.com or give us a call at 781-769-2800

References:
1. Faghri, A. Heat Pipe Science and Technology Taylor & Francis, 1995.
2. Thermacore Internation, Inc., www.thermacore.com.
3. Xiong, D., Azar, K., Tavossoli, B., Experimental Study on a Hybrid

What is a Heat Pipe and How Does it work in Thermal Management? (part 1 of 2)

Heat Pipes have been called Heat Superconductors! In this two part series we’ll talk about what a heat pipe, how they are made, compare them with heat sinks, and talk about performance in various thermal management applications.

Diagram of a basic heat pipeFigure 1 Schematic View of a Heat Pipe [1]

Heat pipes are transport mechanisms that can carry heat fluxes ranging from 10 W/cm2 to 20 KW/cm2 at a very fast speed. Essentially, they can be considered as heat super conductors. Heat pipes can be used either as a means to transport heat from one location to another, or as a means to isothermalize the temperature distribution.

The first heat pipe was tested at Los Alamos National Laboratory in 1963. Since then, heat pipes have been used in such diverse applications as laptop computers, spacecraft, plastic injection molders, medical devices, and lighting systems. The operation of a heat pipe is described in Figure 1.

A heat pipe has three sections: the evaporator, the adiabatic, and the condenser. The interior of the pipe is covered with a wick, and the pipe is partially filled with a liquid such as water. When the evaporator section (Le) is exposed to a heat source, the liquid inside vaporizes and the pressure in that section increases. The increased pressure causes the vapor to flow at a fast speed toward the condenser section of the heat pipe (Lc). The vapor in the condenser section loses heat to the integral heat sink and is converted back to liquid by the transfer of the latent heat of vaporization to the condenser. The liquid is then pumped back to the evaporator through the wick capillary action. The middle section of the heat pipe (La), the adiabatic portion, has a very small temperature difference.

Chart showing pressure drop distribution in a heat sinkFigure 2 Pressure Drop Distribution in a Heat Pipe [1]

Figure 2 shows the pressure drop distribution inside a heat pipe. In order for the capillary force to drive the vapor, the capillary pressure of the wick should exceed the pressure difference between the vapor and the liquid at the evaporator. The graph also shows that if the heat pipe is operated against the force of gravity, the liquid undergoes a larger pressure drop. The result is less pumping of the wick with reduced heat transfer. The amount of heat transfer decrease depends on the particular heat pipe.

A typical heat pipe is made of the following:

  1. Metallic pipe: The metal can be aluminum, copper or stainless steel. It must be compatible with the working fluid to prevent chemical reactions, such as oxidation.
  2. Working fluid: Several types of fluids have been used to date. These include methane, water, ammonia, and sodium. Choice of fluid also depends on the operating temperature range.
  3. Wick: The wick structure comes in different shapes and materials. Figure 3 shows the profiles of common wick types: axial groove, fine fiber, screen mesh, and sintering. Each wick has its own characteristics. For example, the axial groove has good conductivity, poor flow against gravity, and low thermal resistance.
    Conversely, a sintering wick has excellent flow in the opposite direction of gravity, but has high thermal resistance.

Different Wick Structures in a Heat PipeFigure 3 Different Wick Structures

That ends part 1 and in part 2 we’ll address factors that can limit a heat pipes effectiveness, differences in the thermal performance of various heat pipe types, and the spreading resistance of different materials.

Have you got a question on heat pipes or their application? How about an interest in bringing ATS’s team of experienced thermal engineers into one of your projects? You can reach us by visiting http://www.qats.com Purchase heat sinks through our Heat Sink eShop or email us at ats-hq@qats.com or give us a call at 781-769-2800

References:
1. Faghri, A. Heat Pipe Science and Technology Taylor & Francis, 1995.
2. Thermacore Internation, Inc., www.thermacore.com.
3. Xiong, D., Azar, K., Tavossoli, B., Experimental Study on a Hybrid

Aluminum heatsink design uses passive cooling for high end graphics but don’t forget about your chassis fan strategy

At ATS we’ve long been proponents of pushing the limits of thermal management using air. Why? No one wants truly wants to use liquid cooling in their computers be they workstations, servers, telecommunication servers or any other compute engines. Plumbing is something most engineers want to avoid. So our team applauded the release of Sapphire’s passive heatsink cooled graphics card, their HD5670.

The key thing to note on this card thermally is the unique geometry of the aluminum heatsink, aluminum heatpipe and fins. Thin and compressed to their graphics card, the PCI card’s silhouette requires only one X16 lane graphics slot. Sapphire doesn’t mention recommended air flow but they do suggest for best cooling performance, a chassis installed with at least one 120mm or 90mm fan is required.

Our team thought this design was well done, and a great application for passive heatsink cooling. Some thoughts we had included:

First, the required air flow amount and air flow velocity are key for a proper thermal management solution. These will be a function of what else you have in your chassis of course, CPU, memory, disk drives etc. A key critical point is do not block the air flow to known hot components and boards in your chassis. This is a common mistake we see at ATS be it computing or telecommunications. We’ve done a write up on how to choose a fan for your computer chassis on our blog, you can read it by visiting, “Five Basic Steps When Designing for a Cooling Fan Thermal Management

Second, whether your fans are at the air inlet or outlet makes a difference and that needs to be considered. Always mount your cooling fans on the inlet side of your electronics chassis. This allows you to direct the highest velocity airflow to the areas of greatest need. In our example here, the Sapphire graphics card and your CPU (many thanks to Tony Koryban for his wisdom on fan placement)

With creative designs like Sapphires and the correct choice and placement of fans, air cooling continues to be an excellent choice for many thermal management problems. If you need help designing such a passive heatsink approach, drop some mail to us at sales.hq@qats.com