Tag Archives: heat sink attach

What is a Heat Pipe and How Does it work in Thermal Management? (part 1 of 2)

Heat Pipes have been called Heat Superconductors! In this two part series we’ll talk about what a heat pipe, how they are made, compare them with heat sinks, and talk about performance in various thermal management applications.

Diagram of a basic heat pipeFigure 1 Schematic View of a Heat Pipe [1]

Heat pipes are transport mechanisms that can carry heat fluxes ranging from 10 W/cm2 to 20 KW/cm2 at a very fast speed. Essentially, they can be considered as heat super conductors. Heat pipes can be used either as a means to transport heat from one location to another, or as a means to isothermalize the temperature distribution.

The first heat pipe was tested at Los Alamos National Laboratory in 1963. Since then, heat pipes have been used in such diverse applications as laptop computers, spacecraft, plastic injection molders, medical devices, and lighting systems. The operation of a heat pipe is described in Figure 1.

A heat pipe has three sections: the evaporator, the adiabatic, and the condenser. The interior of the pipe is covered with a wick, and the pipe is partially filled with a liquid such as water. When the evaporator section (Le) is exposed to a heat source, the liquid inside vaporizes and the pressure in that section increases. The increased pressure causes the vapor to flow at a fast speed toward the condenser section of the heat pipe (Lc). The vapor in the condenser section loses heat to the integral heat sink and is converted back to liquid by the transfer of the latent heat of vaporization to the condenser. The liquid is then pumped back to the evaporator through the wick capillary action. The middle section of the heat pipe (La), the adiabatic portion, has a very small temperature difference.

Chart showing pressure drop distribution in a heat sinkFigure 2 Pressure Drop Distribution in a Heat Pipe [1]

Figure 2 shows the pressure drop distribution inside a heat pipe. In order for the capillary force to drive the vapor, the capillary pressure of the wick should exceed the pressure difference between the vapor and the liquid at the evaporator. The graph also shows that if the heat pipe is operated against the force of gravity, the liquid undergoes a larger pressure drop. The result is less pumping of the wick with reduced heat transfer. The amount of heat transfer decrease depends on the particular heat pipe.

A typical heat pipe is made of the following:

  1. Metallic pipe: The metal can be aluminum, copper or stainless steel. It must be compatible with the working fluid to prevent chemical reactions, such as oxidation.
  2. Working fluid: Several types of fluids have been used to date. These include methane, water, ammonia, and sodium. Choice of fluid also depends on the operating temperature range.
  3. Wick: The wick structure comes in different shapes and materials. Figure 3 shows the profiles of common wick types: axial groove, fine fiber, screen mesh, and sintering. Each wick has its own characteristics. For example, the axial groove has good conductivity, poor flow against gravity, and low thermal resistance.
    Conversely, a sintering wick has excellent flow in the opposite direction of gravity, but has high thermal resistance.

Different Wick Structures in a Heat PipeFigure 3 Different Wick Structures

That ends part 1 and in part 2 we’ll address factors that can limit a heat pipes effectiveness, differences in the thermal performance of various heat pipe types, and the spreading resistance of different materials.

Have you got a question on heat pipes or their application? How about an interest in bringing ATS’s team of experienced thermal engineers into one of your projects? You can reach us by visiting http://www.qats.com Purchase heat sinks through our Heat Sink eShop or email us at ats-hq@qats.com or give us a call at 781-769-2800

References:
1. Faghri, A. Heat Pipe Science and Technology Taylor & Francis, 1995.
2. Thermacore Internation, Inc., www.thermacore.com.
3. Xiong, D., Azar, K., Tavossoli, B., Experimental Study on a Hybrid

ATS noted in Wikipedia under “Heat Sink” for our clip technology

A reader of our blog wanted us to know that ATS is cited in Wikipedia in their heat sink entry, under heat sink clips. We’re noted for our innovative maxiGRIP Heat Sink Clip.

What makes maxiGRIP so special that we’d get noted?  Well a few things including:

  • maxiGRIP, when used with a heat sink, makes it possible to put to best use thermally efficient phase change thermal interface material.
  • maxiGRIP uses a stainless steel heat sink clip, resulting in a bond that withstands MIL-STD Shock and Vibe levels
  • with maxiGRIP you do not need ANY holes in your PCB, creating more usable space for traces

There’s more to the story, and our friends at Digikey have posted up one of our presentations to give you all the details, you can see it by clicking over to, “maxiGRIP Heat Sink Clip at Digikey”  You may also purchase maxiGRIP products at Digikey.

 

Three questions an engineer should ask prior to using thermal epoxy for their heat sinks

We’ve seen a big uptick in use of epoxy by our customers here at ATS. To our engineers that is alarming. While thermal epoxy initially appears to be a good solution for attaching a heat sink to a chip, accomplishing both the attachment and the thermal interface material in one “quick” glue application design engineers and manufacturing engineers should stop and ask themselves the following three questions before deciding to move ahead.

(1) Does it have to be glued?
Many times glue looks like the easy answer since its generally cost-effective and can be easily applied. But the question “does it have to be clued” really stops you short to make you examine potential alternatives. Don’t forget, thermal epoxy can expire and lose it’s properties.

(2) Is the perceived cost/time savings in assembly worth the actual cost of rework?
Many times thermal epoxy is a quick default choice, “just glue it on” has the sound of a quick solution that should work in average applications.  But that’s not the case.While it looks easy, thermal epoxy requires consistent application to the semiconductor the heat sink is being glues onto. To get that consistent application can require some training (a “soft” cost). But the real caution is the rework. No one “expects” reworks but reworking a company’s computer boards is reality. And with thermal epoxy being used for your heat sinks the rework requires either hot air guns (an additional expense) or destruction of the components under the heat sink. The cost of the rework may exceed the cost savings of using epoxy. Don’t forget the cost of  using thermal epoxy for your heat sinks includes training on how to use epoxy, special equipment to remove epoxied heat sinks and the cost of the material (which has a shelf life and many times must be refrigerated).

(3) Is epoxy being chosen to secure your heatsink?
While the epoxy bond is secure, it’s not foolproof. In fact ATS has seen many epoxied heat sinks that fell off during shock and vibe testing. What generally happens is that heat will weaken the epoxy mechanical bond then, when a strong shock or other mechanical stress is applied, the weakened bond with break, leaving your heat sink in free fall and your semiconductors overheating.

Want some alternatives? Check out our blog post series,

How to choose a heat sink attachment method to secure your heat sink and for optimal heat transfer Part 1

How to choose a heat sink attachment method to secure your heat sink and for optimal heat transfer Part 2

Advanced Thermal Solutions ATS-X53190P-C1-R0 Straight Fin Heat Sink with superGRIP heat sink clip has 24.3 C/W Thermal Resistance at 200LFM

ATS straight fin heat sink with superGRIP heat sink clip Advanced Thermal Solutions ATS-X53190P-C1-R0 Straight Fin Heat Sink with superGRIP attachment has 24.3 C/W Thermal Resistance at 200LFM. Probably one of the best things about this heat sink “system” is the fact that you can use phase change thermal interface material (TIM) with it. Phase change TIM, under the right amount of pressure, can improve your thermal performance from 10% to 20% in a given application.

Speaking of thermal interface material for heat sinks, Jeff McCutcheon, senior technical specialist at 3M, has written a very good article and resources on choosing TIM. You can get a copy at EP&T Magazine: Higher frequencies leading to rising power and EMI in traditionally low power electronic devices

To see a video demo of ATS’s heat sink clip, superGRIP, see below:
[youtube=http://www.youtube.com/watch?v=0MqyNReoo10]

For more information, talk to one of our application engineers or to purchase you may contact us at T: 781-769-2800, email us at sales.hq@qats.com or visit our web site at http://www.qats.com

How to choose a heat sink attachment method to secure your heat sink and for optimal heat transfer (part 2 of 2)

In part 1 of our 2 part series, we laid the ground work for our two part series by noting that there are six main methods you can use to secure a heat sink to a semiconductor

  1. Thermal Tape
  2. Epoxy
  3. Wire Form Z-Clips
  4. Clips
  5. Threaded Stand-offs (PEMS) and Compression Springs
  6. Push-Pins and Compression Springs

In part one we covered thermal tape, epoxy and wire form z-clips. In part two we’ll cover clips, push pins and stand offs and have a special offer for our readers to get all this information in a handy download.

Commercial heat sink clip and ATS maxiGRIP heat sink clip Heat Sink Clips: Heat sink clips are Plastic or plastic/wire clips that grip the components. They are a step above z-clips in ease of use and application. Where a Z-Clip requires a PCB anchor, standard heat sink clips do not. In fact, as long as you have keep out area available around a chip and height available, a clip is a great option. There are many options in using a clip. There are very basic clips, such as those from Malico, which quickly and easily hold a heat sink onto a semiconductor and more advanced clips such as what we at ATS offer in our maxiGRIP and superGRIP clips. The main benefits of a clip are, first, they apply a pre-load to the TIM (thermal interface material) improving thermal performance. Second, they require no holes or anchors in the PCB. This is a very big benefit since clips do not reduce the trace space available for board layout. Third, clips make rework easy by allowing heat sinks to be easily removed and reapplied without damaging the PCB board. Finally, some clips, like maxiGRIP and superGRIP provide a strong enough mechanical attach to pass NEBS, ETSI and MIL shock and vibration. There are some downsides that need to be noted though. First, designers need to insure they design in some keep out area around the semiconductors so that a clip can be used. That also assumes that the design team has considered a thermal management strategy during the architect phase of the product too. Secondly, clips do add extra assembly time since they have to be manually applied.

heat sink being attached to a board using a PEMThreaded Standoffs (PEMS): These are threaded mechanical assemblies that offer the highest level of retention and stability. This approaches benefits include, first, that they are a strong mechanically. They will pass shock and vibe for NEBS, ETSI and MIL.  Second, they provide the highest TIM preload, insuring excellent performance from whatever thermal interface material you choose. Third, they are ideal for heavy copper heat sinks. Finally, they make installation and rework easy since a simple unscrewing of the attach allows the non-destructive removal of the heat sink.  But, as with all heat sink attach methods, there are a few drawbacks to consider. First, they require holes in the PCB removing valuable space for trace. Second they tend to be expensive, especially given that holes need to be drilled into a PCB board to use them.

push pin attach for heat sinks Push-Pins: These are generally plastic or brass push-pin that offer quick and easy mechanical attachment. They are generally equally strong to a threaded standoff (PEMs) approach to heat sink attach. Push pins offer a very strong TIM preload as well as being ideal for large, heavy copper heat sinks. Some of the drawbacks include requiring holes in the PCB board which reduces the trace length space available, a generally complicated assembly process, and finally a fairly high price relative to other solutions.

That wraps up our two part series on heat sink attachment options.

Special offer for our readers to get all this information in a handy download
There’s a lot of material in our two part series on heat sink attachment. To make referencing our series quicker, we’ve assembled this material into a two page “Resource Guide” completed with images as a handy reminder during your next thermal management project.To get a copy, simply drop some email to us at joday@qats.com with the words, “HEAT SINK ATTACH OFFER” in the subject line and we’ll send a copy to you.

If you’re looking for a solution on heat sink attachment and need to bounce this off us, feel free to! ATS sells various heat sinks attachment options, of course, and we’ll talk about that next time, but we’re happy just to discuss your options in your application, so call us at 781-769-2800, email us at sales.hq@qats.com or visit our website at http://qats.com