With Thermal Engineer day approaching (7/24) we here at ATS would like to thank all of the PR firms and digital news magazines who covered our new clipKIT campaign.
As a token of our appreciation, we have provided a link to our customers and viewers to download our clipKIT data sheet for all your attachment needs. HERE.
Posted in ATS News, Uncategorized
Tagged Advanced Thermal Solutions, electronics, electronics cooling, engineering, engineering education, Fan, Fan Characterization, heat sink, heat sink attach, publication, QPedia, temperature measurement, thermal analysis, thermal conductivity, thermal design, thermal engineering, thermal management, webinar, Wind Tunnel
ATS’s maxiFLOW heat sinks provide the highest thermal performance for the physical volume it occupies as compared to other heat sinks designs. The patented, flared fin design reduces junction temperatures by more than 20% compared to standard straight fin, pin fin, or folded fin designs. Watch the video to learn why maxiFLOW heat sinks are superior.
Want to learn more about maxiFLOW heat sinks? Click to the maxiFLOW Main Web Page
Board mounted power supplies are an important part of many electronic systems. There are a number of reasons for that, among them, space savings, lower thermal footprint, and reduction in noise. With those advantages, specifying the right supply is an important task for the design or component engineer. And once you do, characterizing the device is important. The specifications from the manufacturer may be correct in their lab, but, verifying in your lab insures your end product is safe.
Characterizing a device can take many forms based on what the device is, but the overall goal is to insure the device is consistent with the specifications supplied and meets the design point for a given project. In the case of board mounted power supply, thermally characterization is part of this process.
The team at Ericsson has put together a white paper on the thermal characterization of board mounted power supplies in a sealed box: one of the more demanding thermal applications. In the white paper they note:
The white paper does a good job at explaining these pieces and you can get your copy here: Ericsson Board Mounted Power Supply Thermal Characterization Procedure.
Need a heat sink for your next power brick application? See ATS’s power brick family of heat sinks is ready for your hottest power supply application.
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ATS’ own, Dr. Camil Ghiu, will be presenting “Driving Towards 0.1oC/W In Compact Air Cooled Heat Sinks: Advancements In Flow Management And Air Jet Impingement Cooling” at the Thermal Management Industry International Summit: coolingZONE-13. The Summit will be held in Boston, Massachusetts, October 21-23, 2013.
Considering the widespread use of compact systems, such as the 1U platform, and the drive to reduce costs from the system and deployment view points, air cooling continues to be sought for thermal management of such systems. The decrease in size of the new generation of electronic devices imposes a severe constraint on their incorporated thermal management devices. In this context, the development of low thermal resistance heat sinks (0.1 oC/W) for cooling compact electronics systems (1U form factor) continues to be a challenge for the thermal management community.
Dr. Ghiu’s presentation will present recent developments in designing compact heat sinks using advanced air flow management. Two main approaches will be presented, including heat sink design implementing jet impingement and sectional heat sinks. Both design approaches have been explored at ATS, and the experimental data and simulation results will be presented for further discussion.
coolingZONE-13 is the premiere engineering conference for the thermal management industry. Leading experts from academia and the electronics cooling industry will present emerging technologies in the most crucial areas of thermal engineering. A wide range of topics will be discussed, including liquid cooling, advanced heat sink and heat pipe design, thermal interface materials, data center cooling and analysis, CFD, and vapor compression cooling. Keynote speakers this year are Dr. Vincent Manno of Olin College, Dr. Marc Hodes of Tufts University and Dr. Kaveh Azar, CEO of Advanced Thermal Solutions, Inc. Additional speakers and exhibitors from Laird, CD-Adapco, Aavid, Cradle-CFD, Schneider Electric, and Future Facilities will also be presenting at the conference.
Qpedia Thermal eMagazine June 2013
Qpedia Thermal eMagazine, Volume 7, Issue 6, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.
This month’s featured articles include:
Enhancing Heat Sink Performance Using Thermoelectric Coolers
With the increase in the power dissipation of components and the parallel reduction of their size, engineers and researchers across the globe have been predicting that the era of air cooling might come to an end. Even though in some applications, with very high power dissipations such as IGBTs, air cooling may not be adequate and liquid cooling is a must; air cooling will continue to be the first choice for most electronic cooling applications for many years to come. Advances in air cooling continue to extend its use and the implementation of thermoelectric coolers (TECs) in heat sink applications is one such effort.
Immersion Liquid Cooling for Servers in Data Centers
Data center designers and operators have invented many ways to improve the data center’s thermal efficiency, such as optimizing the rack layout and air conditioner location, separating cold aisles and hot aisles, optimizing the configuration of pipes and cables in under-floor plenum, introducing liquid cooling to high-power severs. While the above methods can improve the data center heat load management, they cannot dramatically reduce the Power Usage Effectiveness (PUE). This article reviews two relatively new solutions: active single-phase immersion cooling technology proposed by Green Revolution Cooling (GRC) and a passive two-phase immersion cooling technology proposed by the 3M Company.
Industry Developments: Piezoelectric Cooling
Piezoelectric fans and jets must overcome various materials, thermal and mechanical challenges to become widely used in electronics cooling, but because they consume just 1/150 of the electricity of circular fans, run with little noise and have no parts that will wear out, they remain of great interest. In this article, a number of issues are addressed, including the inverse effect of the piezoelectric phenomena and dual piezoelectric cooling jets.
Technology Review: Innovative Cold Plate Designs, 2007 – 2012
In this issue our spotlight is on innovative cold plate designs. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.
& Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.
Download the issue now.
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Did you know Qpedia also publishes a book series? The five volume set contains 248 in-depth articles, researched and written by veteran engineers. They address the most critical areas of electronics cooling, with a wide spectrum of topics and thorough technical explanation. Order Now.
Posted in Qpedia Thermal eMagazine
Tagged article, cold plate, cold plate design, data center, datacenter, education, electronics, electronics cooling, engineering publication, heat dissipation, heat sink, heat transfer, liquid cooling, magazine, mechanical engineer, mechanical engineering, patent, piezoelectric cooling, piezofan, technology, thermal cooling, thermal design, thermal engineering, thermal management, thermal performance, Thermoelectric Cooler