Tag Archives: reference

Qpedia, Official Media Sponsor of coolingZONE-13, Offers 30% Discount on Esteemed Book Series

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Qpedia, the official media sponsor of coolingZONE-13, has just announced a special promotion offering a 30% discount on the widely read Qpedia Book Series. The promotion will take place at coolingZONE-13, the Thermal Management Industry International Summit in Boston, Massachusetts, October 21st -23rd, 2013. Additionally, the books will be available to purchase through coolingZONE’s online bookstore , with a 25% discount, until the conference ends on October 23. These books provide an expert resource for engineering professionals, students, educators and others who want to learn the latest theories and applications in the electronics cooling field.

The Qpedia Book series is a four volume set of highly technical articles, written and published by Advanced Thermal Solutions, Inc. The authors include Dr. Kaveh Azar, the company’s president and CEO; and Dr. Bahman Tavassoli, its chief technologist. Both Drs. Azar and Tavassoli are internationally recognized experts in the field of thermal management.

The four volume set contains over 250 in-depth articles filled with technical information, fundamental calculations and thoughtful analysis, printed in rich color in a hardbound book. They discuss the most critical areas of electronics cooling, covering a wide spectrum of topics in the telecom, aerospace and defense, embedded computing, medial, automotive, and semiconductor industries.

The articles, inspired by real-life scenarios, solve the thermal management challenges that today’s engineer is faced with. Drawn from personal experience, the veteran authors pass on knowledgeable examples of problem solving techniques that can be applied by all thermal and mechanical engineers. To order the complete book set, or individual volumes, please visit www.coolingzone.com/cart.

coolingZONE-13, the Thermal Management Industry International Summit, is a leading conference for all technical professionals in thermal management, electronics cooling, heat transfer and energy transport fields. The conference gathers recognized experts and technology companies in thermal management, providing solutions for the thermal engineering challenges of the future. Dr. Kaveh Azar, CEO of Advanced Thermal Solutions and Qpedia’s Editor-in-Chief, will be opening the conference with a keynote address on “The State of the Art in Thermal Management – From Vacuum Tubes to Super Computers”. Other keynote addresses include “Redefining Engineering as a Profession of Innovation” by Dr. Vincent Manno of Olin College and “Galinstan-Based Cooling of Microelectronics: Beyond Tuckerman and Pease?” by Dr. Marc Hodes of Tufts University. To learn more about coolingZONE-13, and to register for the conference, please visit: www.coolingzone.com

New Qpedia Thermal eMagazine Published!

Qpedia Thermal eMagazine, Volume 6, Issue 11, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues. Featured articles in this month’s issue include:

Honeycomb Heat Sinks for LEDs

LEDs, or light-emitting diodes, are a form of solid-state lighting. An LED light is often made of a small piece of semiconductor, an integrated optical lens used to shape its radiation pattern, and a heat sink, used to dissipate heat and maintain the semiconductor at low operating temperature. LED lights present many advantages over incandescent light sources, including lower energy consumption, longer lifetime, improved physical robustness, smaller size and faster switching. This article examines Ma et al’s  findings with respect to the honeycomb heat sink design employed in LEDs, which has proven to be highly efficient.

Characteristics of Thermosyphons in Thermal Management

With the increase of heat fluxes and shrinking chip sizes in electronics applications, there is a need to spread the heat from the small chip to the larger heat sink or to transport the heat to a location where there is ample space to remove the heat. Heat pipes, vapor chambers and thermosyphons have been introduced to undertake this task and, in this article, we focus on some aspects of the design of thermosyphons. The advantage of thermosyphons is that they have no capillary limit and can transport large amounts of heat over long distances.

Industry Developments: Heat Pipes Providing High Performance

Heat pipes are increasing in type and use for the benefits they provide. Because of their lower total thermal resistance, heat pipes transfer heat more efficiently and evenly than solid aluminum or copper. Heat pipes contain a small quantity of working fluid (e.g. water, acetone, nitrogen, methanol, ammonia). Learn the conclusions of a recent study that focused on the best working fluid and another study of heat pipes in outer space.

Technology Review: Cold Plates, 2010 to 2012

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

The Perfect Holiday Gift for Any Engineer

Holiday Sale: 25% Off Qpedia Books

The holidays are a time for giving, but ATS provides the engineering community with educational services year round, offering short courses, tutorial programs and free monthly webinars. In addition, ATS publishes Qpedia Thermal eMagazine, the only monthly publication dedicated to the field of thermal management. Over 18,000 engineers subscribe to the magazine, looking to advance their professional careers, academic studies, or understanding of electronics cooling. Qpedia and coolingZONE are running a holiday sale, discounting Qpedia Books by 25%. The Qpedia Book Series is a must have for every engineer, providing detailed and technical explanations for real life challenges that arise in the professional environment of engineers. The promotion is only until December 31st, so don’t miss your chance to order these invaluable books at a discounted price.

Order Now!