Tag Archives: thermal characterization

Flow Visualization in PCB Testing: Part 3

Posted on July 9, 2013 by | Leave a comment

Part 3: Best Wind Tunnels for Flow Visualization

In our final post of the 3 part blog series, we discuss lab equipment that easily allow for optimal flow visualization when testing PCBs.

Our first two posts show the benefits of air and liquid flow visualization in PCB testing. In order to successfully evaluate the thermal performance of a component and PCB, the proper test environment must exist:

A test system that:

  • Accommodates both single components and multiple PCBs
  • Reflects the actual system
  • Can simulate elevated temperature conditions with a controlled flow, if required

 

ATS offers a family of wind tunnels that offer an automated facility for thermal characterization, testing, and optimization of PCBs, components, and heat sinks.

ATS Wind Tunnels

 

All ATS wind tunnels have a large Plexiglas test section for optimal flow visualization. Wind tunnel controllers, such as the WTC-100 and CLWTC-1000 automate testing while accessories such as the HP-97 simulate heat dissipation. Most wind tunnels are easily portable and can be operated vertically or horizontally, maximizing compact lab space.

Rework of PCB layout using flow visualization techniques

Flow visualization is an easy and effective way to understand the flow condition of a component. It allows the PCB layout to be changed at the design stage, reducing the development costs of reworking the board layout after the design has be solidified. It minimizes thermal component costs, increases system reliability, and speeds up a product’s time to market.

To learn more about the wide range of ATS Wind Tunnels, please visit http://www.qats.com/Products/Wind-Tunnels or email ats-hq@qats.com.

Click here for part 1 of this three part series
Click here for part 2 of this three part series

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Posted in Instrument, PCB, Thermal Analysis

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Touch Screen Scanner Simplifies Temperature and Air Velocity Measurement for Thermal Characterization

Posted on February 22, 2013 by | 3 comments

ATVS-NxTThe ATVS-NxT hot wire anemometer is a fully-portable scanner that provides rapid and highly precise temperature and air velocity measurements for the thermal characterization of electronic packages. The ATVS-NxTis member of our temperature & velocity measurement instruments, along with the ATVS-2020 and eATVS-8, but its touch screen feature and embedded pc speaks to its truly unique capability.

The unique touch screen feature allows users to control the stageVIEW software at their fingertips, quickly acquiring temperature and air velocity data, analytics, and reports. It includes an 8 GB hard drive and a CD/RW drive. Ethernet connections allow the scanner to be operated over an intranet or the Internet.
Watch the quick 30 second video showing the ATVS-NxT touch screen feature

The ATVS-NxT supports up to 32 sensors for simultaneous, single-point air velocity and temperature measurements in environments where single or multipoint measurements are required. The sensors are calibrated for both low (natural convection) and high velocity flow rates.

The easy to use ATVS-NxT collects heat and airflow data useful to heat sink manufacturers, IC houses, board designers, and other electronics manufacturers. The scanner’s single-point measurement of temperature and air velocity provides faster, more precise data enabling more efficient thermal management solutions. Visit qats.com to learn more or to request a quote.

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Posted in ATS News, Instrument

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Benchtop Wind Tunnel Can Produce High Flows of Warm Air for Thermal Testing

Posted on September 13, 2012 by | Leave a comment

The CLWT-115 research quality, closed loop wind tunnel from ATS can generate air flows from ambient to 85°C and a rate of up to 50 m/s (10,000 ft/min) for thermally characterizing PCBs and individual components.

The new CLWT-115 wind tunnel from Advanced Thermal Solutions facilitates thermal management studies of electronic components by providing controllable air flows at controllable air temperatures. These features allow faster evaluation of elevated temperatures on component and PCB response and reliability. The CLWT-115 wind tunnel offers a convenient, accurate system for thermally characterizing PCBs and individual components at controlled temperatures from ambient to 85°C.

The new wind tunnel creates consistent, low turbulence air flows of up to 5 m/s (1000 ft/min). It can be customized to generate flows up to 50 m/s (10,000 ft/min) using optionally available orifice plates. The instrument has a clear Lexan test section lets the user view the test specimen and allows for flow visualization.

Because of its closed loop design, the CLWT-115 recirculates internal air. The system heater can quickly warm the air to a specific temperature. This feature is ideal for testing boards and components in hot air, which is a requirement in some NEBS standards. The CLWT-115 wind tunnel can also be used for testing heat sink performance and for calibrating air and temperature sensors.

The CLWT-115 features a test section that can be open from the top door or sides for mounting and repositioning of boards, components and sensors. Rail guides provide an easy mechanism to install test specimens of different sizes (e.g., PCB, heat sink).
Instrument ports (6) are provided in the side walls of the test section for placing temperature and velocity sensors including thermocouples and hotwire
anemometers.

To learn more about the CLWT-115 benchtop wind tunnel, visit Qats.CLWT-115

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New Benchtop Wind Tunnel Tests Boards and Components at Elevated Temperatures

Posted on July 12, 2012 by | 2 comments

The CLWT-115 research quality, closed loop wind tunnel from ATS provides a convenient, accurate system for thermally characterizing PCBs and individual components at controlled temperatures from ambient to 85°C.

Advanced Thermal Solutions, ATS has introduced the CLWT-115 wind tunnel which allows engineers to evaluate the effects of elevated temperatures on component and PCB response and reliability. The new research quality, closed loop wind tunnel provides a convenient, accurate system for thermally characterizing PCBs and individual components at controlled temperatures from ambient to 85°C.

The CLWT-115 wind tunnel produces high quality, low turbulence air flows of up to 5 m/s (1000 ft/min). When customized, it can generate flows up to 50 m/s (10,000 ft/min) using optionally available orifice plates. The clear Lexan test section lets the user view the test specimen and allows for flow visualization.

Unlike open loop wind tunnels, the CLWT-115 recirculates internal air. This allows the system heater to quickly warm the air to a specific temperature. The testing of boards and components in hot air is a requirement in some NEBS and other standards. The precise controls and temperature range of the CLWT-115 wind tunnel allows its use for testing heat sink performance and for calibrating air and temperature sensors.

The complete wind tunnel fits on most lab benches and is powered from standard AC outlets. It has a smaller footprint than traditional, closed loop wind tunnels or environmental test chambers.

The wind tunnel’s test section can be accessed from the top door or sides for mounting and repositioning of boards, components and sensors. Internal rail guides provide an easy mechanism to install test specimens of different sizes (e.g., PCB, heat sink).

Instrument ports (6) are provided in the side walls of the test section for placing temperature and velocity sensors such as thermocouples, Pitot tubes and hotwire anemometers.

For more information about the CLWT-115 benchtop wind tunnel, visit Qats.com or call 1-781-949-2522.

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Posted in Thermal Research

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