In This Issue:

Thermal Modeling of Small Form Factor Pluggable Devices: Different Approaches

Optical transceivers, such as the Small Form Factor Pluggable Device, play an important role in today’s Telecom and Datacom industries by transmitting and receiving data to routers and switches through fiber-optic cables. A SFP’s performance and lifespan are dependent upon the ambient temperature of its operating environment and the thermal packaging of the device. This article will review several thermal modeling techniques for Small Form Factor Pluggable Devices.

Simple Analytical Calculations for Free Convection Cooled Electronic Enclosures

Electronic enclosures are an important component in electronics systems design. In addition to housing and protecting circuit boards, connectors, and additional equipment from its potentially harsh environment, it also provides a cooling mechanism. The design and construction of enclosures for large systems can be a challenging task for electronic and thermal engineers. This article will examine several analytical models for calculating convection cooled electronic enclosures.

Industry Developments: Leak Detectors for Liquid Loop Systems

Liquid leaks occur in wide range of applications, from automobiles and biomedical devices to liquid cooled electronics and water filtration systems. Regardless of the application, liquid leaks are costly to repair and cause significant damage. This article discusses several types of leak detectors, or water damage loss mitigation systems, available on the market for commercial and industrial applications.

Technology Review: Cooling High Performance PCs

In this issue our spotlight is on cooling high performance PCs. There is much discussion about its deployment in the electronics industry and these patents show some of the salient features that are the focus of different inventors.

Cooling News

The latest product releases and news from around the electronics cooling industry.