maxiFLOW Slant Fin HS
DC-DC Converter HS
Zipper Fin
CPU Coolers Passive
Device Specific Heat Sinks
Stamped Heat Sinks
Low Profile Heat Sinks
Cross Cut Heat Sinks
ASIC Heat Sinks
High Capacity Air Cooling™
CPU Coolers Active
fanSINKS™
Extrusions Profile
Slant Fin Extrusion Profile
Pin Fin Extrusion Profile
Straight Fin Extrusion Profile
LED Star HS Extrusion
pcbCLIP™
HS Attachments
Push Pin Heat Sinks
Heat Pipes Round
Heat Pipes Flat
Custom Heat Pipes
HP Bending Tools
Liquid Cooled Heat Sink
High-Performance Cold Plates
DIY Cold Plates
Copper Tubed Cold Plates
Stainless Steel Tubed Cold Plates
Dual Sided Cold Plates
Custom Cold Plates
Flow Meter
Heat Exchangers
Leak Detector
iCDM
Vapor Chambers
Custom Vapor Chamber
Overview
Multi Sensor PBL
Candlestick Sensor
Spot Sensor
Traversing Probe
Micro Sensor
Multi-Sensor in Plane
Hand-Held Surface Probe
Hand-Held Probe
ATVS-NxT™
ATVS-2030™
ATVS-2020™
eATVS-2030™
eATVS-8™
eATVS-4™
iQx-100™
iQ-200™
PTB-1000™
PTM-1000™
ethermVIEW™
thermVIEW™
tvLYT™
TLC-100™
CIP-1000™
DAC-200™
FCM-100™
FSC-200™
HFC-100™
iFLOW-200™
iTHERM-100™
iTHERM-200™
Dual-Cascade Cooling System
Double Cooling System (LED)
Double Cooling System (USB)
Portable Ultra-Low Temperature Freezer
Self-Cascade Refrigeration Systems
TEC Assembly
TEC Modules
CLWT-067™
CLWT-067-PCIe™
CLWT-100™
CLWT-115™
BWT-100™
BWT-104™
CWT-100™
CWT-106™
CWT-107™
CWT-108™
CWT-PCB™
Ceiling Mounted
Desktop
Whole Room
Aerospace Applications
Automotive Applications
Embedded Computing
Internet of Things
LED Applications
Medical Applications
Telecom Applications
Thermal Management Military
Thermal Management PCIe
Chassis Design
Custom Cooling Solutions
Heat Pipe & Vapor Chamber Design
Liquid Cooling System Design
Heat Pipe &Vapor Chamber Design
3D Printing
Die Casting
Electronic Enclosures
Fabrication Capabilities
Finishing Services
Precision Machining
Rapid Prototyping
Zipper Fin & Skiving
About ATS
Environment
Employment Opportunities
Executive Bios
Privacy Policy
Terms of Use
Directions
Sales Representatives & Distributors
Short Courses
Webinar Archive
Webinars
Qpedia
Blog
LinkedIn
Twitter
Instagram
Facebook
Check distribution stock with ECIA’s Trusted Parts authorized search. Users can search across all ATS authorized distributors to check stock and current prices.
See ATS’s surplus inventory of heat sinks, hardware, attachment, screws, and more available at discount prices.
Get a quick response on price and delivery of volume orders or customized solutions.
Customer Notice regarding AD-CVD investigation on aluminum extrusions and how ATS is helping its customers.
High Capacity Air Cooling
Extrusions Profiles
LED STAR HS Extrusion
ATS Chillers
ATS Refrigeration
CLWTC-1000™
HP-97™
WTC-100™
Lab Capabilities
PCB Board Layout & Design
QoolPCB
Systems Integration
Testing & Validation
Case Studies
Image Bank
Presentations
Press Releases
White Papers
Many heat issues can be avoided or resolved when circuit board designs are optimized for thermal management. Optimizing PCBs for thermal management has been proven to ensure reliability, speed time to market and reduce overall costs. Thermal Management for electronics plays a critical role in a wide variety of applications, from medical instruments to automotive controls to telecom devices
ATS provides a range of PCB design services, from CFD studies on boards at the CAD stage to wind-tunnel testing of actual or dummy boards in conditions that simulate air distribution in actual applications. ATS is capable of characterizing boards using research-quality instruments, heat and air velocity sensors, and PCs. Working or dummy PCBs can be tested in isolation or as installed in their own packaging domain. ATS can also perform computational simulations of customer-supplied designs using proprietary programs and computational fluid design packages such as 6SigmaET, which is our lead CFD tool. ATS also uses FloTHERM and CFDesign when a project calls for it.
ATS engineers can improve cooling airflow over populated boards and enhance natural airflow to individual hot components. Often, these studies head off more expensive cooling solutions by showing that minor changes to component layouts or to the volume of airflow will resolve thermal problems.