Heat Sinks Heat Sink Families Heat Sink Attachments Heat Sink Extrusions Custom Heat Sinks Wind Tunnels OverviewClosed Loop Wind TunnelsOpen Loop Wind TunnelsControllers & Accessories Instruments OverviewTemperature & Velocity MeasurementPressure MeasurementSurface ThermographySpecialty InstrumentsInstrument Bundles Sensors OverviewCandlestick SensorMulti-Sensor in PlaneHand-Held Surface ProbeMulti Sensor PBLTraversing ProbeMicro SensorSpot SensorHand-Held Probe VOSTOK Freezers OverviewSelf-Cascade Refrigeration SystemsDual-Cascade Cooling SystemDouble Cooling System with LED Temperature ContollerDouble Cooling System with USB PortPortable Ultra-Low Temperature Freezer Vortx Air Cleansers OverviewAir Filtration Systems Heat Pipes & Vapor Chambers Overview Heat Pipes Round & Flat Heat Pipe Bending Tools Vapor Chambers Liquid Cooling OverviewCold PlatesDual-Sided Cold PlatesTubed Cold PlatesCustom Cold PlatesHeat ExchangersChillersFlow MeterLeak DetectoriCDMRefrigerationLiquid Cooled Heat Sinks TEC OverviewTEC AssemblyTEC Modules Click below for ATS’ heat sinks with Thermal Tape offerings: Cross Cut maxiFLOW™ fanSINK Pin Fin Slant Fin Standard Board Level Straight Fin Heat Sink Attachment Options Heat Sink Technical Articles Video: Heat Sink Attachments Thermal Tape Thermally Conductive Adhesive Transfer Tapes Thermally conductive carrier material : T412 T766 3M 8815 Laird Phase Change Material Easy to attach Most cost-effective Suitable for low-mass heat sinks Suitable for components with low power dissipation Double sided pressure sensitive adhesive Excellent thermal properties as low as 10 psi. Rework without damage to sensitive components The interface material plays a pivotal role in transporting the heat from the component to the heat sink. The tape is applied to the base of the heat sink and then the heat sink is attached to the component. For tape to work well, proper cleaning of the component surface and the base of heat sink is required. Also, it is usually necessary to apply the tape with a certain amount of pressure. Providing efficient thermal transfer for a wide range of applications including: Bonding heat sinks Heat spreaders IC packages Power transistors and more
