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  • 60.0 x 40.0 x 8.0 mm BGA Heat Sink - High Performance Device Specific - NVIDIA
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
60.0 x 40.0 x 8.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
Heat Sink
Product Details
  • ATS-NVA-2781-C1-R0
  • 60.0 x 40.0 x 8.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
  • NVIDIA Jetson Xavier™ NX
  • Active heat sink (fan not included)
  • Leaf spring with screws
  • N/A
  • See detail
  • See detail
Specifications

NVIDIA Heat Sinks Features & Benefits

  • Designed to fit the NVIDIA® Jetson Xavier™ NX module.
  • Leaf spring with screws for mounting heat sink
  • Included mounting hardware kit: ATS-HK510-R0
    • (leaf spring with M2 x 0.4mm shoulder screws - drive: Torx T8)
  • Fan assembly hole pattern is 32.0mm C-C (center to center)
  • Included fan attachment kit: ATS-HK509-R0 (M3 x 18mm screws)
  • Fan not included - ATS recommended fans listed below
  • Provided with pre-assembled Thermal Interface Material (TIM) on base
  • Recommended through hole size in PCB is 3.20 mm (PCB thickness: 1.2 mm)
Jetson-Nano-module
Recommended Fans
Part NumberManufacturerL
(mm)		W
(mm)		H
(mm)		Voltage
(VDC)		Air Flow
(CFM)		Static Pressure
(Pa)		Lead Wire
AFB0405HHA-ADelta40401058.2 (0.230m³/min)47.3Black (-), Red (+)
109P0412H901Sanyo Denki404010125.3 (0.148m³/min)41.1B (-), R (+), Y (Sensor)
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 MOUNTING HOLE PATTERN
CENTER TO CENTER
(MM)		 Weight
(gr)		 TIM FINISH
ATS-NVA-2781-C1-R0 ACTIVE 60.0 40.0 8.0 43.2 x 28.8 36.8 Chomerics T766 Black Anodized
Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length | B:Width | C: Height | D&E: Mounting Hole Pattern
200 1.0 1.6 N/A
400 2.0 N/A N/A
600 3.0 N/A N/A
800 4.0 N/A N/A
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