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  • 90.0 x 90.0 x 28.0 mm BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
90.0 x 90.0 x 28.0 mm  BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers
Heat Sink
Product Details
  • ATS-UC-NF-201
  • 90.0 x 90.0 x 28.0 mm  BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers
  • N/A
  • straightFIN Heat Sink
  • PEM
  • N/A
  • See detail
  • See detail
Specifications
  • Designed for for 1U and 2U or any application with front to back air flow Designed for CPUs that fit the Intel™ LGA2011 square and LGA2066 sockets (Socket R)
  • Mechanical attachment is PEM, screws and spring – for other types of attachments contact ATS
  • Provided with Chomerics T670 thermal grease
  • Hardware provides 9.2 PSI (63 kPa) when installed
  • Aluminum and copper heat sink material with standard or dense fin spacing provide a wide set of performance ranges for various applications.
  • To apply this heat sink to other high power devices and processors such as non-Intel CPU, FPGA, AI Processors, or GPUs the optional ATS-HK379-R0 PCB backing plate can be used, please contact ATS for more details.
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 Fin Tip to Fin Tip
(mm)		 TIM FINISH
ATS-UC-NF-201 ACTIVE 90.0 90.0 28.0 N/A Chomerics T670 thermal grease Nickel Plated
Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip. 		100 0.5 N/A 0.2
200 1.0 N/A 0.7
300 1.5 N/A N/A
400 2.0 N/A 0.4
500 2.5 N/A N/A
600 3.0 N/A 0.3
700 3.5 N/A N/A
800 4.0 N/A 0.3
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