In This Issue:
Vapor Chambers with Boiling Enhanced Multi-Wick Structures
Solid heat sinks utilize conduction to transfer the heat from the heat source (e.g., CPU) to the fin field; therefore, facing design limitations such as weight and volume. Additionally, conventionally built heat sinks may not meet the thermal resistance specifications for high-end applications. As an alternative, a vapor chamber can be specified instead of a solid heat sink base. This article presents a review of results obtained with novel-designed vapor chambers, using a multi-wick structure for enhanced boiling
Microchannel Heat Sink Application in IGBT Modules
Advancements in semiconductor technology have pushed engineers to look for more innovative and effective methods to cool semiconductor devices with increasing power density. There have been continuing efforts to shrink the Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated Gate Bipolar Transistor (IGBT) gate size. However, this has made it impossible, for a standard electronics package that is pure air-cooled, to handle the heat load dissipated by some high-power devices. This paper discusses several methods of using liquid-cooled microchannel heat sinks on high-power IGBT modules.
Industry Developments: Phase Change Materials
Phase change materials (PCMs) have a wide range of industrial applications. In most cases, they provide some form of thermal management, including as a storage medium and as thermal interface materials. As cooling needs for electronics have evolved, phase change materials have seen improved performance, as well. Mainly these have been formulation and assembly changes, including lower thermal resistance, improved strength and reduced thickness. This article explores the latest developments in PCMs.
Technology Review: Cooling Techniques for IGBT Devices
In this issue our spotlight is on cooling techniques for IGBT devices. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.
Cooling News
