Banner for ATS Qpedia

The Online Publication and Book Series Dedicated to the Thermal Management of Electronics

Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc., Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each issue provides practical approaches to thermal management challenges and explains the new technologies for successfully cooling today and tomorrow’s hot-running electronics.

Advance Qpedia Search
Enter Keyword :
Exact phrase Any word








Table of Contents - February 2014

Current Issues

February 2014

IN THIS ISSUE:

 

Thermoelectric Cooler Optimization for Deployment in Electronics Thermal Management

Thermoelectric coolers, (TECs), are solid state refrigeration devices which use DC currents to generate cooling or heating. Unlike traditional vapor-compression refrigeration systems, thermoelectric coolers don’t have moving parts or fluid circulating. Its simple structure and small size makes it a good choice for a thermal management device in electronics. However, the low coefficient of performance (COP) of TEC hampers its wide deployment. This paper discusses an optimized TEC cooling method, which keeps the   high-power electronic component’s junction temperature inside an air-cooled chassis at the required temperature.

 

Theoretical Cooling Limit of a Thermosyphon

Passive, two phase liquid cooling schemes for thermal management of electronics rely on heat pipes and thermosyphons. Thermosyphons are passive cooling devices able to overcome the capillary limitation of heat pipes by using gravitationally induced buoyancy to drive the flow. There are several configurations in which thermosyphons can be deployed. This article reviews an analytical approach for finding the theoretical cooling limit for a thermosyphon with a flow boiling arrangement.

 

Industry Developments: Heat Spreader Options and Materials

A heat spreader is typically a solid or liquid filled chamber that disperses the heat on the surface that is larger than the heat source size. In general, heat spreaders are used when a heat source has a high heat-flux density and its size is much smaller than the contact area to the heat exchanger or heat sink. This article will discuss the latest advancements of heat spreaders, including the use of Copper, Graphene and Aluminum Diamond Metal Matrix Composite (MMC) materials.

 

Technology Review: Liquid Filled Heat Sinks, 2002-2013

In this issue our spotlight is on liquid filled heat sinks. There is much discussion about its deployment in the electronics industry and these patents show some of the salient features that are the focus of different inventors.

 

Cooling News

The latest product releases and news from around the electronics cooling industry.