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  • 63.0 x 40.0 x 8.0 mm BGA Heat Sink - High Performance Device Specific - NVIDIA
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
63.0 x 40.0 x 8.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
Heat Sink
Product Details
  • ATS-NVP-3353-C2-R2
  • 63.0 x 40.0 x 8.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
  • NVIDIA Jetson Nano™ TX2 NX
  • Straight fin heat sink
  • Leaf spring with screws
  • N/A
  • See detail
  • See detail
Specifications

Features & Benefits

  • Designed to fit the NVIDIA® Jetson™ TX2 NX module
  • Leaf spring with screws for mounting heat sink - see Fig. 1
  • Included mounting hardware kit: ATS-HK513-R0 (leaf spring with M2 x 0.4mm shoulder screws - drive: Torx T8)
  • Provided with pre-assembled Thermal Interface Material (TIM) on base
  • Recommended through hole size in PCB is 3.20 mm (PCB thickness: 1.2 mm)
Jetson TX2 NX Module
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 MOUNTING HOLE PATTERN
CENTER TO CENTER
(MM)		 Weight
(gr)		 TIM FINISH
ATS-NVP-3353-C2-R2 ACTIVE 63.0 40.0 8.0 23 34.3 Chomerics T766 Black Anodized
Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length | B:Width | C: Height | D&E: Mounting Hole Pattern
200 1.0 2.6 N/A
400 2.0 1.8 N/A
600 3.0 1.6 N/A
800 4.0 1.4 N/A