In This Issue:
Thermal Characterization of a Multi-Chip Module
Multi-Chip Modules (MCMs) are increasing in popularity due to its size, speed and quality advantages. However, multiple heat sources on the same carrier creates unique thermal calculation challenges because is not enough to determine the individual temperature of each junction. This article discusses methods for approximating the junction temperature of a MCM.
Boundary Condition Dependency of Junction to Case Thermal Resistance
The junction to case (θjc) thermal resistance of a semiconductor package is a useful and frequently utilized metric in the thermal management of electronics. This article investigates the dependence of the θjc of power packages on different cooling boundary conditions and gives an assessment of the accuracy of two measurement methods: the traditional method using thermocouples to measure the case temperature and the recently proposed transient dual interface (TDI) method.
Industry Developments: Pulsating Heat Pipes
Heat pipes are passive heat transport devices that work via phase change (evaporation and condensation) to transfer heat from the evaporator site to a condenser location where heat is dissipated. A pulsating heat pipe (PHP), sometimes called an oscillating heat pipe, converts heat from the heat-generating area into liquid-slugs. This article looks at recent developments involving cold and open look PHPs.
Technology Review: Cooling Using Phase Change Materials
In this issue our spotlight is on cooling using phase change materials. There is much discussion about its deployment in the electronics industry and these patents show some of the salient features that are the focus of different inventors.
Cooling News
The latest product releases and news from around the electronics cooling industry.