IN THIS ISSUE:

Conduction-Convection Cooling Solution for 3D Stacked Electronics

3D stacking of ICs has emerged as an extremely promising technology able to address the performance requirements of tomorrow’s high speed computing. This novel technology enables integration of logic, memory, RF and optoelectronic devices on a single chip. However, the rate of generated heat and thermal resistance provide a significant thermal challenge. This article reviews the design and thermal parametric study of a unique liquid interface thermal management solution for a 3D chip stack.

Thermal Characteristics of Wickless Vapor Chambers

With trends towards smaller component footprint and higher power dissipation in electronic components, the need to spread the heat over the base of the heat sink has become very important to reduce the spreading resistance. Vapor chambers offer a good solution for applications that need to have a uniform temperature distribution. In this article we will look at the various vapor chamber design options.

Industry Developments: Phase Change Materials

For engineers working in electronics thermal management, phase-change materials are an effective type of thermal interface material. They’re typically used between cooling solution and power generating electronics and devices and can provide thermal performance superior to dry TIM pads. This article will review different applications, in addition to thermal management, where phase change materials can be applied.

Technology Review: 3D Stacked Die Packages

In this issue our spotlight is on 3D stacked die packages. There is much discussion about its deployment in the electronics industry and these patents show some of the salient features that are the focus of different inventors.

Cooling News

The latest product releases and news from around the electronics cooling industry.