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  • 57.5 x 40.0 x 23.0 mm BGA Heat Sink - High Performance Device Specific - NVIDIA
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
57.5 x 40.0 x 23.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
Heat Sink
Product Details
  • ATS-NVA2-3554-C3-R0
  • 57.5 x 40.0 x 23.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
  • NVIDIA Jetson Orin™ NX (Super Mode)
  • Active heat sink (fan not included)
  • Leaf spring with screws
  • N/A
  • See detail
  • See detail
Specifications

Features & Benefits

  • Designed to fit the NVIDIA®Jetson Orin™ NX module
  • Cooling capacity up to 40W - compatible with Orin NX Super Mode
  • Leaf spring with screws for mounting heat sink
  • Included mounting hardware kit: ATS-HK510-R1
    • (leaf spring with M2 x 9.2mm shoulder screws - drive: Torx T8)
  • Included f an attachment kit: ATS-HK542-R0 (M3 x 25mm screws)
  • Fan not included - ATS recommended fans listed below
  • Provided with pre-assembled Thermal Interface Material (TIM) on base
  • Recommended through hole size in PCB is 3.20 mm (PCB thickness: 1.2 mm)
Jetson Orin Nano Orin NX modules
Recommended Fans
Part NumberManufacturerL
(mm)		W
(mm)		H
(mm)		Voltage
(VDC)		Air Flow
(CFM)		Static Pressure
(Pa)		Lead Wire
AFB0412SHB-F00Delta4040151214.8 (0.42 m³/min)149.73
9GA0412P7G001Sanyo Denki4040151212.7 (0.36 m³/min)1924
PSD1204PHB1-ASunon4040151214.0 (0.40 m³/min)156.92
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 MOUNTING HOLE PATTERN
CENTER TO CENTER
(MM)		 MOUNTING HOLE DIAMETER
(MM)		 Weight
(gr)		 TIM FINISH
ATS-NVA2-3554-C3-R0 ACTIVE 57.5 40.0 23.0 43.2 X 28.8 1.6 56.0 Chomerics T766 Black Anodized
Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length | B:Width | C: Height | D&E: Mounting Hole Pattern | F: Mounting Hole Diameter
200 1.0 0.9 N/A
400 2.0 N/A N/A
600 3.0 N/A N/A
800 4.0 N/A N/A