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  • 100.0 x 87.0 x 16.0 mm BGA Heat Sink - High Performance Device Specific - NVIDIA
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
100.0 x 87.0 x 16.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
Heat Sink
Product Details
  • ATS-NVP-3275-C5-R0
  • 100.0 x 87.0 x 16.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
  • NVIDIA® Jetson AGX Xavier™ and Jetson AGX Orin™
  • Straight fin
  • Stainless steel screw
  • N/A
  • See detail
  • See detail
Specifications

NVIDIA Heat Sinks Features & Benefits

  • Designed to fit the NVIDIA® Jetson AGX Xavier™ and Jetson AGX Orin™ modules.
  • Provided with pre-assembled Thermal Interface Material (TIM) on base
  • Mounting Screws - M3x0.5 (3mm standard) - Thread length: 30
  • Recommended through hole size in PCB is 3.40 mm
Jetson-Nano-module
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 MOUNTING HOLE PATTERN
CENTER TO CENTER
(MM)		 MOUNTING HOLE DIAMETER
(MM)		 Weight
(gr)		 TIM FINISH
ATS-NVP-3275-C5-R0 ACTIVE 100.0 87.0 16.0 43.2 x 28.8 4.5 167.7 Chomerics T766 Black Anodized
Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length | B:Width | C: Height | D&E: Mounting Hole Pattern | F: Mounting Hole Diameter
200 1.0 0.5 N/A
400 2.0 0.3 N/A
600 3.0 0.3 N/A
800 4.0 0.2 N/A
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